MEMORY DEVICE CARRIER FOR HIGH DENSITY FRONT SERVICEABLE RACK DRIVE CHASSIS

    公开(公告)号:US20180352679A1

    公开(公告)日:2018-12-06

    申请号:US15612093

    申请日:2017-06-02

    Abstract: A memory device carrier is described that is particular suitable for a high density rack drive chassis in which the drives are front serviceable. In one example, a memory system includes an enclosure configured to mount in a rack, the enclosure having a front configured to receive airflow and a rear configured for cabling, a drawer configured to slide longitudinally in and out of the enclosure, the drawer having a bottom surface and a front face, and a longitudinal connector board mounted to the drawer having a plurality of memory device sockets, the sockets facing outward laterally from the longitudinal board and configured to receive memory devices inserted laterally into a respective socket.

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