公开(公告)号：US11301011B2

公开(公告)日：2022-04-12

申请号：US16696072

申请日：2019-11-26

Applicant: INTEL CORPORATION

Inventor： Ketan R. Shah ,  Tawfik M. Rahal-Arabi ,  Eric DiStefano ,  James G. Hermerding, II

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/20 ,  G06F1/3203

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

公开(公告)号：US20200218319A1

公开(公告)日：2020-07-09

申请号：US16696072

申请日：2019-11-26

Applicant: INTEL CORPORATION

Inventor： Ketan R. Shah ,  Tawfik M. Rahal-Arabi ,  Eric DiStefano ,  James G. Hermerding, II

IPC: G06F1/20 ,  G06F1/26

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.