公开(公告)号：US20190114434A1

公开(公告)日：2019-04-18

申请号：US16229496

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Haifeng GONG ,  Vasudevan SRINIVASAN ,  Antonio J. HASBUN MARIN

IPC: G06F21/57 ,  G06F21/60 ,  H04L9/32

Abstract: A system includes a processor coupled to an integrated circuit. The processor includes a non-volatile memory to store instructions to perform a boot process. The boot process is discontinued to prevent unauthorized use of the processor if a value received from the integrated circuit in response to a first value sent to the integrated is not valid.

公开(公告)号：US20210072806A1

公开(公告)日：2021-03-11

申请号：US16642161

申请日：2017-09-29

Applicant: INTEL CORPORATION

Inventor： Yanbing SUN ,  Xiaoguo LIANG ,  Haifeng GONG ,  Ming ZHANG

IPC: G06F1/20 ,  G06F3/06 ,  G11C7/04

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510,610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal. The SSD (10, 110, 210, 310, 410, 510,610, 710) also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature.

公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.