公开(公告)号：US20190102029A1

公开(公告)日：2019-04-04

申请号：US16086475

申请日：2016-06-21

Applicant: INTEL CORPORATION

Inventor： Hong W. WONG ,  Wah Yiu KWONG ,  Xiaoguo LIANG ,  Jiancheng TAO ,  Yanbing SUN

IPC: G06F3/041 ,  G06F1/16 ,  H03K19/173 ,  H04R1/04

CPC classification number: G06F3/0414 ,  G06F1/1643 ,  G06F1/169 ,  H03K19/1733 ,  H04R1/04

Abstract: In one example a input device for an electronic device comprises a first panel comprising an array of pressure sensors, a second panel comprising an array of apertures in fluid communication with the pressure sensors, and a controller comprising logic, at least partly including hardware logic, to receive a plurality of output signals from the plurality of pressure sensors, determine, from the plurality of output signals, a location of an input on the second panel, and generate a data point on a bitmap corresponding to the location of the input on the second panel. Other examples may be described.

公开(公告)号：US20170344084A1

公开(公告)日：2017-11-30

申请号：US15487995

申请日：2017-04-14

Applicant: INTEL CORPORATION

Inventor： Yanbing SUN ,  Ming ZHANG

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1656

Abstract: An electronic device may be provided that includes a body having one or more electronic components. The body may have a first portion and a second portion. The second portion may include a first layer of material comprising a first metal and a second layer of material comprising a second metal. At least one electronic component may be between the first portion and the second portion

公开(公告)号：US20170160775A1

公开(公告)日：2017-06-08

申请号：US15325609

申请日：2014-08-11

Applicant: Intel Corporation

Inventor： Yanbing SUN ,  Yongkang WU ,  Jeff KING ,  Peifeng SI

IPC: G06F1/20 ,  B60H1/00 ,  F24F11/00 ,  B60H1/22

CPC classification number: G06F1/206 ,  B60H1/00021 ,  B60H1/00642 ,  B60H1/00664 ,  B60H1/22 ,  F24F11/79 ,  G06F1/20

Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.

公开(公告)号：US20230092972A1

公开(公告)日：2023-03-23

申请号：US18070433

申请日：2022-11-28

Applicant: Intel Corporation

Inventor： Phil GENG ,  Guixiang TAN ,  Yanbing SUN ,  Xiang LI ,  George VERGIS ,  Sanjoy K. SAHA

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/473 ,  H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

公开(公告)号：US20220225542A1

公开(公告)日：2022-07-14

申请号：US17710640

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Tong Wa CHAO ,  Mark BIANCO ,  Yanbing SUN ,  Ming ZHANG ,  Guixiang TAN ,  Devdatta P. KULKARNI ,  Guocheng ZHANG ,  Hao ZHOU

IPC: H05K7/20 ,  G11C5/04

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

公开(公告)号：US20210072806A1

公开(公告)日：2021-03-11

申请号：US16642161

申请日：2017-09-29

Applicant: INTEL CORPORATION

Inventor： Yanbing SUN ,  Xiaoguo LIANG ,  Haifeng GONG ,  Ming ZHANG

IPC: G06F1/20 ,  G06F3/06 ,  G11C7/04

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510,610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal. The SSD (10, 110, 210, 310, 410, 510,610, 710) also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature.

公开(公告)号：US20160187943A1

公开(公告)日：2016-06-30

申请号：US14124353

申请日：2012-12-27

Applicant: INTEL CORPORATION

Inventor： Yanbing SUN ,  Ming ZHANG

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/1656

Abstract: An electronic device may be provided that includes a body having one or more electronic components. The body may have a first portion and a second portion. The second portion may include a first layer of material comprising a first metal and a second layer of material comprising a second metal. At least one electronic component may be between the first portion and the second portion

Abstract translation: 可以提供一种电子设备，其包括具有一个或多个电子部件的主体。 主体可以具有第一部分和第二部分。 第二部分可以包括第一层材料，其包括第一金属和第二层材料，其包括第二金属。 至少一个电子部件可以在第一部分和第二部分之间