公开(公告)号：US10249924B2

公开(公告)日：2019-04-02

申请号：US14752642

申请日：2015-06-26

申请人： Intel Corporation

发明人： Kai Xiao ,  Raul Enriquez Shibayama ,  Gong Ouyang ,  Jose Diego Guillen Gonzalez ,  Beom-Taek Lee

IPC分类号： G06F3/041 ,  H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H01P5/02

摘要： Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.

公开(公告)号：US20160378215A1

公开(公告)日：2016-12-29

申请号：US14752642

申请日：2015-06-26

申请人： INTEL CORPORATION

发明人： Kai Xiao ,  Raul Enriquez Shibayama ,  Gong Ouyang ,  Jose Diego Guillen Gonzalez ,  Beom-Taek Lee

IPC分类号： G06F3/041 ,  H01P3/08

CPC分类号： H01P3/08 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/09645 ,  H05K2201/09854

摘要： Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.

摘要翻译： 提供延伸穿过印刷电路板（PCB）或其它基板的至少一部分的通孔的紧凑布置的技术和机构。 在一个实施例中，衬底包括电介质材料和形成至少部分延伸穿过电介质材料的孔区的侧壁结构。 孔区域邻接第一通孔和第二通孔中的每一个，并且还位于第一通孔和第二通孔之间。 在另一个实施例中，第一通孔被耦合以交换差分信号对的第一信号，并且第二通孔被耦合以交换相同差分信号对的第二信号。