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公开(公告)号:US20170255560A1
公开(公告)日:2017-09-07
申请号:US15505879
申请日:2014-09-25
Applicant: INTEL CORPORATION
Inventor: Sai LUO , Tin-Fook NGAI , Hu CHEN , Xiaocheng ZHOU , Chunxiao LIN , Kang ZHAO
IPC: G06F12/0842 , G06F12/0831 , G06F12/0875
CPC classification number: G06F12/0842 , G06F11/36 , G06F11/3632 , G06F12/0831 , G06F12/0833 , G06F12/0875 , G06F2212/1016 , G06F2212/1032 , G06F2212/452 , G06F2212/621
Abstract: A processing device includes a processing core, coupled to a memory, to execute a task including a code segment identified as being monitored and a kernel recorder, coupled to the processing core via a core interface. The kernel recorder includes a first filter circuit to responsive to determining that the task being executed enters the code segment, set the kernel recorder to a first mode under which the kernel recorder is to record, in a first record, a plurality of memory addresses accessed by the code segment, and responsive to determining that the execution of the task exits the code segment, set the kernel recorder to a second mode under which the kernel recorder is to detect a write operation to a memory address recorded in the first record and record the memory address in a second record.
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2.
公开(公告)号:US20160283438A1
公开(公告)日:2016-09-29
申请号:US15038710
申请日:2013-12-23
Applicant: Hu Tiger CHEN , Liang CHEN , Chunxiao LIN , Sai LUO , Hai Ge TIAN , Rui Gang WANG , Tin Fook NGAI , INTEL CORPORATION
Inventor: Hu Tiger CHEN , Liang CHEN , Chunxiao LIN , Sai LUO , Hai Ge TIAN , Rui Gang WANG , Tin-Fook NGAI
CPC classification number: G06F15/80 , G06F13/4027 , G06F13/4068 , G06F15/7807 , Y02D10/12 , Y02D10/13 , Y02D10/14 , Y02D10/151
Abstract: A processing device includes a first processor module comprising a first core designed according to a first instruction set (ISA), and a second processor module comprising a second core designed according to a second ISA. The first and second processor modules are fabricated on a same die.
Abstract translation: 一种处理装置包括:第一处理器模块,包括根据第一指令集(ISA)设计的第一核心;以及第二处理器模块,包括根据第二ISA设计的第二核心。 第一和第二处理器模块被制造在相同的芯片上。
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