公开(公告)号：US20190271720A1

公开(公告)日：2019-09-05

申请号：US16410852

申请日：2019-05-13

Applicant: Intel Corporation

Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

IPC: G01R1/04 ,  G01R1/073

Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

公开(公告)号：US11340287B2

公开(公告)日：2022-05-24

申请号：US16045242

申请日：2018-07-25

Applicant: Intel Corporation

Inventor： Ramaswamy Parthasarathy ,  Vikas Rao ,  Praveen Pai

IPC: G01R31/28 ,  G01K11/12 ,  H05K7/20 ,  H05K1/02 ,  C09D11/50 ,  H01G2/00

Abstract: Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.

公开(公告)号：US20180120347A1

公开(公告)日：2018-05-03

申请号：US15341726

申请日：2016-11-02

Applicant: INTEL CORPORATION

Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

IPC: G01R1/04 ,  G01R1/30

CPC classification number: G01R1/0416 ,  G01R1/07371

Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.

公开(公告)号：US11538731B2

公开(公告)日：2022-12-27

申请号：US16368049

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Vikas Rao ,  Sandesh Geejagaaru Krishnamurthy ,  Navneet Kumar Singh ,  Unnikrishnan Gopinanthan Pillai

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/48

Abstract: Embodiments disclosed herein include electronic packages with improved thermal performance. In an embodiment, the electronic package comprises a first package substrate, a first die stack over the first package substrate, and a heat spreader over the first die stack. In an embodiment, the heat spreader comprises arms that extend out past sidewalls of the first package substrate. In an embodiment, the electronic package further comprises an interposer over and around the heat spreader, where the interposer is electrically coupled to the first package substrate by a plurality of interconnects. In an embodiment, the electronic package further comprises a second package substrate over the interposer, and a second die over the second package substrate.

公开(公告)号：US10656177B2

公开(公告)日：2020-05-19

申请号：US16410852

申请日：2019-05-13

Applicant: Intel Corporation

Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

IPC: G01R1/04 ,  G01R1/073

Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

公开(公告)号：US10317428B2

公开(公告)日：2019-06-11

申请号：US15341726

申请日：2016-11-02

Applicant: INTEL CORPORATION

Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

IPC: G01R1/04 ,  G01R1/073

Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.