EMBEDDED THREE-DIMENSIONAL ELECTRODE CAPACITOR

    公开(公告)号:US20220084936A1

    公开(公告)日:2022-03-17

    申请号:US17024507

    申请日:2020-09-17

    Abstract: Embedded three-dimensional electrode capacitors, and methods of fabricating three-dimensional electrode capacitors, are described. In an example, an integrated circuit structure includes a first metallization layer above a substrate, the first metallization layer having a first conductive structure in a first dielectric layer, the first conductive structure having a honeycomb pattern. An insulator structure is on the first conductive structure of the first metallization layer. A second metallization layer is above the first metallization layer, the second metallization layer having a second conductive structure in a second dielectric layer, the second conductive structure on the insulator structure, and the second conductive structure having the honeycomb pattern.

    HIGH END IMAGING RADAR
    2.
    发明申请

    公开(公告)号:US20220196821A1

    公开(公告)日:2022-06-23

    申请号:US17369994

    申请日:2021-07-08

    Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.

    V-GROOVE FIBER STOP
    3.
    发明申请

    公开(公告)号:US20250102740A1

    公开(公告)日:2025-03-27

    申请号:US18373851

    申请日:2023-09-27

    Abstract: A device comprising a silicon substrate and a waveguide on the silicon substrate. A groove is in the substrate, the groove having a sloped rear wall adjacent to the waveguide. A trench is in the substrate, the trench along a second direction generally orthogonal to the first direction across the sloped rear wall, the trench having a vertical wall at an intersection with the sloped rear wall. An optical fiber in the groove with one end of the optical fiber abutting the vertical wall.

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