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公开(公告)号：US20220207750A1
公开(公告)日：2022-06-30
申请号：US17572517
申请日：2022-01-10
Applicant: Intel Corporation
Inventor： Yuming LI , Zhen ZHOU , Xiaodong WANG , Quan YIN
Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.
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公开(公告)号：US20240106126A1
公开(公告)日：2024-03-28
申请号：US18352296
申请日：2023-07-14
Applicant: Intel Corporation
Inventor： Zhen ZHOU , Tolga ACIKALIN , Kenneth FOUST , Shuhei YAMADA , Tae Young YANG , Timothy F. COX , Renzhi LIU , Richard DORRANCE , Johanny ESCOBAR PELAEZ
CPC classification number: H01Q9/0414 , H01Q1/2283 , H01Q9/045
Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.
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公开(公告)号：US20220196821A1
公开(公告)日：2022-06-23
申请号：US17369994
申请日：2021-07-08
Applicant: Intel Corporation
Inventor： Arnaud AMADJIKPE , Timo Sakari HUUSARI , Tae Young YANG , Hossein ALAVI , Steven CALLENDER , Bradley JACKSON , Ofer MARKISH , Woorim SHIN , Shengbo XU , Zhen ZHOU , Wei QIAN , Mengyuan HUANG
Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.
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公开(公告)号：US20200033888A1
公开(公告)日：2020-01-30
申请号：US15573313
申请日：2016-12-22
Applicant: INTEL CORPORATION
Inventor： Ke HAN , Zhen ZHOU , Guangyu REN , Zhiqiang QIN
Abstract: Apparatus, method and storage medium associated with UAV position estimation are disclosed herein. In embodiments, an UAV may comprise a transmitter-receiver arrangement to transmit and receive communication signals, including receipt of absolute positioning system (APS) signals from one or more APS sensors, and wireless signals from one or more proximately located other UAVs; one or more motors or engines to provide propulsive force for the UAV; and a flight controller coupled to the transmitter-receiver arrangement and the one or more motors or engines to control at least the one or more motors or engines to provide propulsive force to navigate the UAV, based at least in part on the APS and relative positioning signals. Other embodiments may be disclosed or claimed.
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公开(公告)号：US20220206064A1
公开(公告)日：2022-06-30
申请号：US17133659
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： Zhen ZHOU , Renzhi LIU , Jong-Ru GUO , Kenneth P. FOUST , Jason A. MIX , Kai XIAO , Zuoguo WU , Daqiao DU
IPC: G01R31/302 , H01P3/08 , H01Q9/16 , H04B5/02 , G01R31/28 , G01R31/303
Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.
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Patent Agency Ranking
公开(公告)号：US20190045622A1
公开(公告)日：2019-02-07
申请号：US15817098
申请日：2017-11-17
Applicant: Intel Corporation
Inventor： Jun LIAO , Zhen ZHOU , James A. McCALL , Jong-Ru GUO , Xiang LI , Yunhui CHU , Zuoguo WU
Abstract: An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.
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公开(公告)号：US20250112357A1
公开(公告)日：2025-04-03
申请号：US18817279
申请日：2024-08-28
Applicant: Intel Corporation
Inventor： Zhen ZHOU , Tae Young YANG , Shuhei YAMADA , Tolga ACIKALIN , Renzhi LIU , Kenneth FOUST , Bryce HORINE
IPC: H01Q1/22 , H01L23/31 , H01L23/538 , H01L25/00 , H01L25/065 , H01Q1/48 , H01Q5/40 , H01Q9/04
Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.
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公开(公告)号：US20230420396A1
公开(公告)日：2023-12-28
申请号：US18253954
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Tolga ACIKALIN , Arnaud AMADJIKPE , Brent R. CARLTON , Chia-Pin CHIU , Timothy F. COX , Kenneth P. FOUST , Bryce D. HORINE , Telesphor KAMGAING , Renzhi LIU , Jason A. MIX , Sai VADLAMANI , Tae Young YANG , Zhen ZHOU
IPC: H01L23/66 , H01Q9/42 , H01Q1/22 , H01Q9/36 , H01Q21/24 , H01L25/065 , H01L23/00 , H01L23/538
CPC classification number: H01L23/66 , H01Q9/42 , H01Q1/2283 , H01Q9/36 , H01Q21/24 , H01L25/0652 , H01L2924/1421 , H01L24/16 , H01L23/5381 , H01L2223/6677 , H01L2224/16145 , H01L2224/16235 , H01L25/0655
Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.
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公开(公告)号：US20220199556A1
公开(公告)日：2022-06-23
申请号：US17131863
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Zhen ZHOU , Tae Young YANG , Tolga ACIKALIN , Johanny ESCOBAR PELAEZ , Kenneth P. FOUST , Chia-Pin CHIU , Renzhi LIU , Cheng-Yuan CHIN
Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.
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公开(公告)号：US20200214647A1
公开(公告)日：2020-07-09
申请号：US16642561
申请日：2017-09-30
Applicant: INTEL CORPORATION
Abstract: Technologies for monitoring a health-risk condition of a user include a virtual reality compute device having one or more near infrared (NIR) sensors. The virtual reality compute device presents a virtual reality (VR) presentation to the user. The virtual reality compute device produces sensor data through the one or more NIR sensors that is indicative of a heart rate of the user and a blood pressure of the user while the VR presentation is presented to the user. The virtual reality compute device determines whether the user is in a health-risk condition based on a comparison of the heart rate of the user to a heart rate safety threshold and a comparison of the blood pressure of the user to a blood pressure safety threshold. The virtual reality compute device performs a health-risk condition response in response to a determination that the user is in the health-risk condition.
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