公开(公告)号：US09159646B2

公开(公告)日：2015-10-13

申请号：US13713935

申请日：2012-12-13

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: G01R31/02 ,  G01R31/26 ,  H01L23/48 ,  H01L21/66 ,  H01L27/02

CPC classification number: H01L22/34 ,  G01R31/2642 ,  H01L22/32 ,  H01L23/48 ,  H01L23/50 ,  H01L27/0207 ,  H01L27/0255 ,  H01L27/0296 ,  H01L27/0676 ,  H01L28/20 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

Abstract translation: 描述了一种装置，包括：输入垫; 输出板 电线，其耦合到所述输入焊盘和所述输出焊盘，所述导线定位在半导体管芯的周围，所述焊丝基本上沿着所述半导体管芯的周边延伸; 以及一个或多个二极管，其耦合在所述导线的各个部分处，并且沿着所述半导体管芯的周边定位并围绕所述半导体管芯。

公开(公告)号：US20170141006A1

公开(公告)日：2017-05-18

申请号：US15421338

申请日：2017-01-31

Applicant: INTEL CORPORATION

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: H01L21/66 ,  G01R31/26 ,  H01L29/861 ,  H01L49/02 ,  H01L27/02 ,  H01L23/50

CPC classification number: H01L22/34 ,  G01R31/2642 ,  H01L22/32 ,  H01L23/48 ,  H01L23/50 ,  H01L27/0207 ,  H01L27/0255 ,  H01L27/0296 ,  H01L27/0676 ,  H01L28/20 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

公开(公告)号：US10026664B2

公开(公告)日：2018-07-17

申请号：US15421338

申请日：2017-01-31

Applicant: INTEL CORPORATION

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: G01R31/02 ,  H01L21/66 ,  H01L27/02 ,  H01L23/50 ,  H01L29/861 ,  H01L49/02 ,  G01R31/26

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

公开(公告)号：US09564381B2

公开(公告)日：2017-02-07

申请号：US14876728

申请日：2015-10-06

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: G01R31/02 ,  H01L21/66 ,  H01L23/48 ,  G01R31/26 ,  H01L27/02 ,  H01L23/50 ,  H01L27/06 ,  H01L49/02 ,  H01L29/861

CPC classification number: H01L22/34 ,  G01R31/2642 ,  H01L22/32 ,  H01L23/48 ,  H01L23/50 ,  H01L27/0207 ,  H01L27/0255 ,  H01L27/0296 ,  H01L27/0676 ,  H01L28/20 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

Abstract translation: 描述了一种装置，包括：输入垫; 输出板 电线，其耦合到所述输入焊盘和所述输出焊盘，所述导线定位在半导体管芯的周围，所述焊丝基本上沿着所述半导体管芯的周边延伸; 以及一个或多个二极管，其耦合在所述导线的各个部分处，并且沿着所述半导体管芯的周边定位并围绕所述半导体管芯。

公开(公告)号：US20160043011A1

公开(公告)日：2016-02-11

申请号：US14876728

申请日：2015-10-06

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: H01L21/66 ,  H01L27/06 ,  H01L49/02 ,  H01L29/861 ,  H01L23/50 ,  H01L27/02

CPC classification number: H01L22/34 ,  G01R31/2642 ,  H01L22/32 ,  H01L23/48 ,  H01L23/50 ,  H01L27/0207 ,  H01L27/0255 ,  H01L27/0296 ,  H01L27/0676 ,  H01L28/20 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

Abstract translation: 描述了一种装置，包括：输入垫; 输出板 电线，其耦合到所述输入焊盘和所述输出焊盘，所述导线定位在半导体管芯的周围，所述焊丝基本上沿着所述半导体管芯的周边延伸; 以及一个或多个二极管，其耦合在所述导线的各个部分处，并且沿着所述半导体管芯的周边定位并围绕所述半导体管芯。