公开(公告)号：US20140217356A1

公开(公告)日：2014-08-07

申请号：US13759711

申请日：2013-02-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： CAN BAYRAM ,  JACK O. CHU ,  CHRISTOS DIMITRAKOPOULOS ,  JEEHWAN KIM ,  HONGSIK PARK ,  DEVENDRA K. SADANA

IPC: H01L33/04

CPC classification number: H01L33/14 ,  H01L21/02378 ,  H01L21/02527 ,  H01L21/02612 ,  H01L33/0079 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device includes a spreading layer and a first contact layer formed over and contacting the spreading layer. The first contact layer is formed from a thermally conductive crystalline material having a thermal conductivity greater than or equal to that of an active layer material. An active layer includes one or more III-nitride layers. A second contact layer is formed over the active layer, wherein the active layer is disposed vertically between the first and second contact layers to form a vertical thin film stack.

Abstract translation: 电子设备包括扩散层和形成在扩散层上并与扩散层接触的第一接触层。 第一接触层由具有大于或等于有源层材料的导热性的导热结晶材料形成。 有源层包括一个或多个III族氮化物层。 在有源层上形成第二接触层，其中有源层垂直地设置在第一和第二接触层之间以形成垂直薄膜叠层。