公开(公告)号：US20150270219A1

公开(公告)日：2015-09-24

申请号：US14733652

申请日：2015-06-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ROBERT L. BRUCE ,  QINGHUANG LIN ,  ALSHAKIM NELSON ,  SATYANARAYANA V. NITTA ,  DIRK PFEIFFER ,  JITENDRA S. RATHORE

IPC: H01L23/528 ,  H01L29/06 ,  H01L23/532

CPC classification number: H01L23/5283 ,  H01L21/76801 ,  H01L21/76804 ,  H01L21/76808 ,  H01L21/7682 ,  H01L21/76825 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76832 ,  H01L21/76835 ,  H01L23/5222 ,  H01L23/5329 ,  H01L23/53295 ,  H01L29/0649 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region.

Abstract translation: 互连结构包括直接位于图案化的永久抗反射涂层的表面上的图案化和固化的电介质层。 图案化和固化的介电层和永久性抗反射涂层形成成形的开口。 成形的开口包括朝向成形开口的顶部变窄的反向轮廓。 导电结构填充成形开口，其中图案化和固化的介电层和永久性抗反射涂层各自具有导电填充区域。