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公开(公告)号:US20140131800A1
公开(公告)日:2014-05-15
申请号:US13676817
申请日:2012-11-14
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Alan B. Botula , Mark D. Jaffe , Alvin J. Joseph , Richard A. Phelps , James Slinkman , Randy L. Wolf
CPC classification number: H01L29/0603 , H01L21/26513 , H01L21/7624 , H01L21/84 , H01L22/14 , H01L22/20 , H01L27/1203 , H01L29/16 , H01L2924/0002 , H01L2924/00
Abstract: A silicon device includes an active silicon layer, a buried oxide (BOX) layer beneath the active silicon layer and a high-resistivity silicon layer beneath the BOX layer. The device also includes a harmonic suppression layer at a boundary of the BOX layer and the high-resistivity silicon layer.
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公开(公告)号:US20140306325A1
公开(公告)日:2014-10-16
申请号:US14313444
申请日:2014-06-24
Applicant: International Business Machines Corporation
Inventor: Alan B. Botula , Mark D. Jaffe , Alvin J. Joseph , Richard A. Phelps , James Slinkman , Randy L. Wolf
IPC: H01L29/06
CPC classification number: H01L29/0603 , H01L21/26513 , H01L21/7624 , H01L21/84 , H01L22/14 , H01L22/20 , H01L27/1203 , H01L29/16 , H01L2924/0002 , H01L2924/00
Abstract: A silicon device includes an active silicon layer, a buried oxide (BOX) layer beneath the active silicon layer and a high-resistivity silicon layer beneath the BOX layer. The device also includes a harmonic suppression layer at a boundary of the BOX layer and the high-resistivity silicon layer.
Abstract translation: 硅器件包括有源硅层,有源硅层下面的掩埋氧化物(BOX)层和BOX层下面的高电阻率硅层。 该装置还包括在BOX层和高电阻率硅层的边界处的谐波抑制层。
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公开(公告)号:US08828746B2
公开(公告)日:2014-09-09
申请号:US13676817
申请日:2012-11-14
Applicant: International Business Machines Corporation
Inventor: Alan B. Botula , Mark D. Jaffe , Alvin J. Joseph , Richard A. Phelps , James Slinkman , Randy L. Wolf
IPC: H01L21/02
CPC classification number: H01L29/0603 , H01L21/26513 , H01L21/7624 , H01L21/84 , H01L22/14 , H01L22/20 , H01L27/1203 , H01L29/16 , H01L2924/0002 , H01L2924/00
Abstract: A silicon device includes an active silicon layer, a buried oxide (BOX) layer beneath the active silicon layer and a high-resistivity silicon layer beneath the BOX layer. The device also includes a harmonic suppression layer at a boundary of the BOX layer and the high-resistivity silicon layer.
Abstract translation: 硅器件包括有源硅层,有源硅层下面的掩埋氧化物(BOX)层和BOX层下面的高电阻率硅层。 该装置还包括在BOX层和高电阻率硅层的边界处的谐波抑制层。
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