公开(公告)号：US09324601B1

公开(公告)日：2016-04-26

申请号：US14536175

申请日：2014-11-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/00 ,  H01L23/34 ,  H01L21/683 ,  H01L21/306 ,  H01L21/304 ,  H01L25/03 ,  H01L21/762 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract translation: 提供了一种微电子器件处理中的粘合方法，其包括用包含苯氧基树脂的粘合剂将处理晶片粘合到器件晶片的前侧; 以及当器件晶片与处理晶片粘合地接合时，从器件晶片的背面使器件晶片变薄。 在器件晶片减薄之后，可以通过激光剥离除去包含苯氧基树脂的粘合剂，其中将器件晶片与处理晶片分离。

公开(公告)号：US20190088481A1

公开(公告)日：2019-03-21

申请号：US15859608

申请日：2017-12-31

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  H01L21/683 ,  B24B7/22

CPC classification number: H01L21/2007 ,  B24B7/228 ,  H01L21/6835 ,  H01L23/49827 ,  H01L2221/68318 ,  H01L2221/6834

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US09748131B2

公开(公告)日：2017-08-29

申请号：US14943691

申请日：2015-11-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/00 ,  H01L23/34 ,  H01L21/683 ,  H01L25/03 ,  H01L21/762 ,  H01L23/00 ,  H01L21/463 ,  H01L21/306 ,  H01L21/304 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US20160204015A1

公开(公告)日：2016-07-14

申请号：US15077113

申请日：2016-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/683 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US20160133501A1

公开(公告)日：2016-05-12

申请号：US14943691

申请日：2015-11-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/683 ,  H01L21/768 ,  H01L21/306

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US10651036B2

公开(公告)日：2020-05-12

申请号：US16550261

申请日：2019-08-25

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/544 ,  H01L23/498 ,  H01L21/56

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10395929B2

公开(公告)日：2019-08-27

申请号：US15859608

申请日：2017-12-31

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/498

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US09601364B2

公开(公告)日：2017-03-21

申请号：US15077113

申请日：2016-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/00 ,  H01L23/34 ,  H01L21/683 ,  H01L25/03 ,  H01L21/762 ,  H01L23/00 ,  H01L21/463 ,  H01L21/306 ,  H01L21/304 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US10658182B2

公开(公告)日：2020-05-19

申请号：US16551377

申请日：2019-08-26

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/544 ,  H01L23/498 ,  H01L21/56

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US20190088480A1

公开(公告)日：2019-03-21

申请号：US15709876

申请日：2017-09-20

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.