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公开(公告)号：US09850406B2
公开(公告)日：2017-12-26
申请号：US14865251
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Robert D. Allen , Jeffrey Gelorme , Li-Wen Hung , Ratnam Sooriyakumaran , Linda K. Sundberg
IPC: H01L21/683 , C09J129/10 , H01L21/50 , C09J125/08 , C08F212/08 , C09J133/06
CPC classification number: C09J129/10 , C08F212/08 , C09J125/08 , C09J133/06 , H01L21/50 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y02P20/582 , C08F222/40 , C08F222/06 , C08F2222/402
Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
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公开(公告)号：US09601364B2
公开(公告)日：2017-03-21
申请号：US15077113
申请日：2016-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Robert D. Allen , Paul S. Andry , Jeffrey D. Gelorme , Li-wen Hung , John U. Knickerbocker , Cornelia K. Tsang
IPC: H01L21/00 , H01L23/34 , H01L21/683 , H01L25/03 , H01L21/762 , H01L23/00 , H01L21/463 , H01L21/306 , H01L21/304 , H01L21/768
CPC classification number: H01L21/6836 , H01L21/304 , H01L21/30604 , H01L21/463 , H01L21/6835 , H01L21/76256 , H01L21/76898 , H01L24/27 , H01L24/29 , H01L24/83 , H01L25/03 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68381
Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
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公开(公告)号：US09235124B2
公开(公告)日：2016-01-12
申请号：US13736512
申请日：2013-01-08
Applicant: International Business Machines Corporation
Inventor： Robert D. Allen , Mark W. Hart , Ratnam Sooriyakumaran
CPC classification number: G03F7/0752 , C09D7/63 , G03F7/094
Abstract: Molecular glass based planarizing compositions for lithographic processing are disclosed. The processes generally include casting the planarizing composition onto a surface comprised of lithographic features, the planarizing composition comprising at least one molecular glass and at least one solvent; and heating the planarizing composition to a temperature greater than a glass transition temperature of the at least one molecular glass. Exemplary molecular glasses include polyhedral oligomeric silsesquioxane derivatives, calixarenes, cyclodextrin derivatives, and other non-polymeric large molecules.
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4.发明申请公开(公告)号：US20150189743A1
公开(公告)日：2015-07-02
申请号：US14644416
申请日：2015-03-11
Applicant: International Business Machines Corporation
Inventor： Robert D. Allen , Phillip J. Brock , Blake W. Davis , Qinghuang Lin , Robert D. Miller , Alshakim Nelson , Ratnam Sooriyakumaran
IPC: H05K1/03
CPC classification number: H05K1/0326 , C09D183/04 , C09D183/14 , H01B3/307 , H01L21/02126 , H01L21/02216 , H01L21/3122 , H01L21/76802 , H01L21/76808 , H01L21/76814 , H05K2201/0162
Abstract: Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers.
Abstract translation: 倍半硅氧烷聚合物，负色调可光图案化电介质配方中的倍半硅氧烷聚合物，使用含有倍半硅氧烷聚合物的负色调可光图案化电介质配方形成结构的方法，以及由倍半硅氧烷聚合物制成的结构。
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公开(公告)号：US20210036323A1
公开(公告)日：2021-02-04
申请号：US16525642
申请日：2019-07-30
Applicant: International Business Machines Corporation
Inventor： Jangwoo Kim , Young-Hye Na , Robert D. Allen
Abstract: A battery includes an anode, an electrolyte including a solvent and at least one ion conducting salt, and a cathode including a metal halide salt incorporated into an electrically conductive material. The electrolyte is in contact with the anode, the cathode, and an oxidizing gas.
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Patent Agency Ranking
公开(公告)号：US09324601B1
公开(公告)日：2016-04-26
申请号：US14536175
申请日：2014-11-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Robert D. Allen , Paul S. Andry , Jeffrey D. Gelorme , Li-wen Hung , John U. Knickerbocker , Cornelia K. Tsang
IPC: H01L21/00 , H01L23/34 , H01L21/683 , H01L21/306 , H01L21/304 , H01L25/03 , H01L21/762 , H01L23/00
CPC classification number: H01L21/6836 , H01L21/304 , H01L21/30604 , H01L21/463 , H01L21/6835 , H01L21/76256 , H01L21/76898 , H01L24/27 , H01L24/29 , H01L24/83 , H01L25/03 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68381
Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Abstract translation: 提供了一种微电子器件处理中的粘合方法，其包括用包含苯氧基树脂的粘合剂将处理晶片粘合到器件晶片的前侧; 以及当器件晶片与处理晶片粘合地接合时，从器件晶片的背面使器件晶片变薄。 在器件晶片减薄之后，可以通过激光剥离除去包含苯氧基树脂的粘合剂，其中将器件晶片与处理晶片分离。
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公开(公告)号：US08951599B2
公开(公告)日：2015-02-10
申请号：US13677573
申请日：2012-11-15
Applicant: International Business Machines Corporation
Inventor： Robert D. Allen , Christopher E. Bannister , Jere J. Brophy , Richard A. DiPietro
CPC classification number: A61L31/04 , A61L15/225
Abstract: A wound dressing and a method of making the wound dressing is described herein. The wound dressing is formed of an absorbent substrate formed of one or more layers and a low-adherence layer disposed on the substrate. The low-adherence layer can be disposed within at least a portion of the substrate. The low-adherence layer is formed of a mixture of at least one highly fluorinated polymer and at least one acidic polymer. The at least one highly fluorinated polymer has a fluorine content greater than the fluorine content of the at least one acidic polymer.
Abstract translation: 本文描述了伤口敷料和制造伤口敷料的方法。 伤口敷料由一层或多层形成的吸收性衬底和设置在衬底上的低粘附层形成。 低粘附层可以设置在基底的至少一部分内。 低粘附层由至少一种高度氟化的聚合物和至少一种酸性聚合物的混合物形成。 至少一种高度氟化的聚合物的氟含量大于至少一种酸性聚合物的氟含量。
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公开(公告)号：US08900802B2
公开(公告)日：2014-12-02
申请号：US13775122
申请日：2013-02-23
Inventor： Robert D. Allen , Ramakrishnan Ayothi , Luisa D. Bozano , William D. Hinsberg , Linda K. Sundberg , Sally A. Swanson , Hoa D. Truong , Gregory M. Wallraff
CPC classification number: G03F7/325 , G03F7/0045 , G03F7/0046 , G03F7/0392 , G03F7/0397
Abstract: Provided is a method for developing positive-tone chemically amplified resists with an organic developer solvent having at least one polyhydric alcohol, such as ethylene glycol and/or glycerol, alone or in combination with an additional organic solvent, such as isopropyl alcohol, and/or water. The organic solvent developed positive tone resists described herein are useful for lithography pattern forming processes; for producing semiconductor devices, such as integrated circuits (IC); and for applications where basic solvents are not suitable, such as the fabrication of chips patterned with arrays of biomolecules or deprotection applications that do not require the presence of acid moieties.
Abstract translation: 提供了一种用具有至少一种多元醇如乙二醇和/或甘油的有机显影剂溶剂单独或与另外的有机溶剂如异丙醇和/或其混合物形成的正性化学放大抗蚀剂的方法，和/ 或水。 本文所述的有机溶剂显影的正色调抗蚀剂可用于光刻图案形成工艺; 用于制造诸如集成电路（IC）的半导体器件; 并且对于不适合碱性溶剂的应用，例如用不需要存在酸部分的生物分子或去保护应用阵列图案化的芯片的制造。
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公开(公告)号：US11335908B2
公开(公告)日：2022-05-17
申请号：US16525642
申请日：2019-07-30
Applicant: International Business Machines Corporation
Inventor： Jangwoo Kim , Young-Hye Na , Robert D. Allen
Abstract: A battery includes an anode, an electrolyte including a solvent and at least one ion conducting salt, and a cathode including a metal halide salt incorporated into an electrically conductive material. The electrolyte is in contact with the anode, the cathode, and an oxidizing gas.
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公开(公告)号：US20200071557A1
公开(公告)日：2020-03-05
申请号：US16118510
申请日：2018-08-31
Inventor： Jeannette M. Garcia , Alireza Rahimi , Robert D. Allen , John Hobbs , Michael Firmian
IPC: C09D123/12 , C08K5/3442 , F16L58/10 , F16L1/26 , F16L13/02 , F16L58/18 , C08K5/3415 , C08K5/00 , C08K5/3492
Abstract: Extrudable compositions were prepared comprising poly(propylene) and a liquid additive comprising a lactam group. The compositions can comprise other optional additives that include a polyhemiaminal, antioxidants, UV light absorbers, and surfactants. The extruded compositions have higher percent elongation at break and lower Young's modulus compared to extruded poly(propylene) lacking the liquid additive. These and other property improvements make the extruded compositions attractive for forming field joint coatings for undersea pipeline applications.
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