公开(公告)号：US20140145747A1

公开(公告)日：2014-05-29

申请号：US13689090

申请日：2012-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Nathaniel R. CHADWICK ,  John B. DEFORGE ,  John J. ELLIS-MONAGHAN ,  Jeffrey P. GAMBINO ,  Ezra D. HALL ,  Marc D. KNOX ,  Kirk D. PETERSON

IPC: G01R31/26 ,  H01L29/00

CPC classification number: H01L29/00 ,  G01R31/2818 ,  G01R31/2856 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A test circuit including a light activated test connection in a semiconductor device is provided. The light activated test connection is electrically conductive during a test of the semiconductor device and is electrically non-conductive after the test.

Abstract translation: 提供一种包括半导体器件中的光激活测试连接的测试电路。 在半导体器件的测试期间，光激发测试连接是导电的，并且在测试之后是非导电的。

公开(公告)号：US20140332810A1

公开(公告)日：2014-11-13

申请号：US13890776

申请日：2013-05-09

Applicant: International Business Machines Corporation

Inventor： Luc GUERIN ,  Marc D. KNOX ,  George J. LAWSON ,  Van T. TRUONG ,  Steve WHITEHEAD

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

Abstract translation: 包括用于3D晶片的电/热测试期间使用的用于表面张力粘合和热控制的液体热界面材料的组件和使用方法。 该方法包括通过在其间施加非粘合材料并将薄的晶片和空白的硅基载体晶片压在一起，将薄的晶片临时附接到载体晶片。