OPTIMAL MATERIALS AND DEVICES DESIGN USING ARTIFICIAL INTELLIGENCE

    公开(公告)号:US20230281363A1

    公开(公告)日:2023-09-07

    申请号:US17685645

    申请日:2022-03-03

    IPC分类号: G06F30/27

    CPC分类号: G06F30/27 G06F2111/06

    摘要: A system and method for optimizing materials and devices design. The method includes building machine learning models to predict a quality of target measurements based on an experimental design input by formulating a regularized multi-objective optimization to recommend the final experimental design using a logistic curve for the loss function and a model uncertainty quantification term for the final solution. Alternately, the system and method uses a black-box optimization for optimal process design that includes iteratively building a sequence of surrogate functions, where intermediate designs are generated to improve the quality of the surrogate function. Further a derivative-free optimization is performed that utilizes global optimization techniques (global search) with Gaussian process (local method) with a Bayesian optimization to produce a sequence of designs that leads to an optimal design. The system and method is used in machine learning/deep learning for tuning hyperparameters and an architecture search of prediction models.

    Method and system for wafer quality predictive modeling based on multi-source information with heterogeneous relatedness
    3.
    发明授权
    Method and system for wafer quality predictive modeling based on multi-source information with heterogeneous relatedness 有权
    基于具有异构相关性的多源信息的晶圆质量预测建模方法和系统

    公开(公告)号:US09176183B2

    公开(公告)日:2015-11-03

    申请号:US13651974

    申请日:2012-10-15

    摘要: The present invention generally relates to the monitoring and controlling of a semiconductor manufacturing environment and, more particularly, to methods and systems for virtual meteorology (VM) applications based on data from multiple tools having heterogeneous relatedness. The methods and systems leverage the natural relationship of the multiple tools and take advantage of the relationship embedded in process variables to improve the prediction performance of the VM predictive wafer quality modeling. The prediction results of the methods and systems can be used as a substitute for or in conjunction with actual metrology samples in order to monitor and control a semiconductor manufacturing environment, and thus reduce delays and costs associated with obtaining actual physical measurements.

    摘要翻译: 本发明一般涉及半导体制造环境的监视和控制,更具体地说,涉及基于具有异构相关性的多个工具的数据的虚拟气象(VM)应用的方法和系统。 该方法和系统利用了多种工具的自然关系,利用嵌入在过程变量中的关系来提高VM预测晶圆质量建模的预测性能。 方法和系统的预测结果可以用作实际计量样本的替代或与实际计量样本结合,以便监测和控制半导体制造环境,从而减少与获得实际物理测量相关联的延迟和成本。

    Method and System for Wafer Quality Predictive Modeling based on Multi-Source Information with Heterogeneous Relatedness
    4.
    发明申请
    Method and System for Wafer Quality Predictive Modeling based on Multi-Source Information with Heterogeneous Relatedness 有权
    基于具有异构相关性的多源信息的晶片质量预测建模方法与系统

    公开(公告)号:US20140107824A1

    公开(公告)日:2014-04-17

    申请号:US13677542

    申请日:2012-11-15

    IPC分类号: G06F19/00

    摘要: The present invention generally relates to the monitoring and controlling of a semiconductor manufacturing environment and, more particularly, to methods and systems for virtual meteorology (VM) applications based on data from multiple tools having heterogeneous relatedness. The methods and systems leverage the natural relationship of the multiple tools and take advantage of the relationship embedded in process variables to improve the prediction performance of the VM predictive wafer quality modeling. The prediction results of the methods and systems can be used as a substitute for or in conjunction with actual metrology samples in order to monitor and control a semiconductor manufacturing environment, and thus reduce delays and costs associated with obtaining actual physical measurements.

    摘要翻译: 本发明一般涉及半导体制造环境的监视和控制,更具体地说,涉及基于具有异构相关性的多个工具的数据的虚拟气象(VM)应用的方法和系统。 该方法和系统利用了多种工具的自然关系,利用嵌入在过程变量中的关系来提高VM预测晶圆质量建模的预测性能。 方法和系统的预测结果可以用作实际计量样本的替代或与实际计量样本结合,以便监测和控制半导体制造环境,从而减少与获得实际物理测量相关联的延迟和成本。

    AUTOMATED OPERATING MODE DETECTION FOR A MULTI-MODAL SYSTEM

    公开(公告)号:US20230281364A1

    公开(公告)日:2023-09-07

    申请号:US17686708

    申请日:2022-03-04

    IPC分类号: G06F30/27

    CPC分类号: G06F30/27 G06F2111/08

    摘要: A system and method for learning a predictive function that can automatically learn different operating modes for a multi-modal system and predict the number of operating states for a multi-modal system and additionally the detailed structure for each state. Once learned, the predictive function (model) can be used to determine a mode of a new sample (an asset). Based on the determined components that maximize a log likelihood function, a mode of the new sample is detected into the model via dependency graphs. One aspect includes enforcing a lower bound for the number of sample points to form an operational mode for an asset. While a mode relates to sample points which maximizes like log-likelihood, an ability is provided to remove artifact modes due to noisy data by considering a sufficient sample data condition and maximizing log-likelihood. Domain knowledge can be incorporated into the model via dependency graphs.

    Wafer asset modeling using language processing methods

    公开(公告)号:US11599690B2

    公开(公告)日:2023-03-07

    申请号:US16933972

    申请日:2020-07-20

    摘要: A computing device includes a processor and a storage device. A wafer asset modeling module is stored in the storage device and is executed by the processor to configure the computing device to perform acts identifying and clustering a plurality of assets based on static properties of a wafer asset using a first module of the wafer asset modeling module. The clustered plurality of assets is determined based on dynamic properties of the wafer asset using a second module of the wafer asset modeling module. Event prediction is performed by converting a numeric data of the clustered plurality of assets to a natural language processing (NLP) domain by a third module of the wafer asset modeling module. One or more sequence-to-sequence methods are performed to predict a malfunction of a component of the wafer asset and/or an event based on past patterns. Prediction information is stored in the storage device.

    WAFER ASSET MODELING USING LANGUAGE PROCESSING METHODS

    公开(公告)号:US20220019710A1

    公开(公告)日:2022-01-20

    申请号:US16933972

    申请日:2020-07-20

    IPC分类号: G06F30/20 G06F40/40

    摘要: A computing device includes a processor and a storage device. A wafer asset modeling module is stored in the storage device and is executed by the processor to configure the computing device to perform acts identifying and clustering a plurality of assets based on static properties of a wafer asset using a first module of the wafer asset modeling module. The clustered plurality of assets is determined based on dynamic properties of the wafer asset using a second module of the wafer asset modeling module. Event prediction is performed by converting a numeric data of the clustered plurality of assets to a natural language processing (NLP) domain by a third module of the wafer asset modeling module. One or more sequence-to-sequence methods are performed to predict a malfunction of a component of the wafer asset and/or an event based on past patterns. Prediction information is stored in the storage device.

    VEHICLE ASSET MODELING USING LANGUAGE PROCESSING METHODS

    公开(公告)号:US20220019708A1

    公开(公告)日:2022-01-20

    申请号:US16933977

    申请日:2020-07-20

    IPC分类号: G06F30/15 G06F40/40

    摘要: A computing device includes a processor and a storage device. A vehicle asset modeling module is stored in the storage device and is executed by the processor to configure the computing device to perform acts of identifying and clustering a plurality of assets based on static properties of a vehicle asset using a first module of the vehicle asset modeling module. The clustered plurality of assets is determined based on dynamic properties of the vehicle asset using a second module. Event prediction is performed by converting a numeric data of the clustered plurality of assets to a natural language processing (NLP) domain by a third module. One or more sequence-to-sequence methods are performed to predict a malfunction of a component of the vehicle asset and/or an event based on past patterns. Prediction information is stored in the storage device.