公开(公告)号：US20150208502A1

公开(公告)日：2015-07-23

申请号：US14161228

申请日：2014-01-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Dana H. BROWN ,  Hanyi DING ,  Yan DING ,  John S. FERRARIO

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/11 ,  H05K3/4697 ,  H05K2201/10189 ,  Y10T29/49004

Abstract: A broadband through printed circuit board (PCB) for millimeter wave application and methods of manufacture are disclosed. The structure includes a multiple layered body and an opening in the multiple layered body. The structure further includes at least one signal via extending through the opening. The structure further includes ground vias extending through the opening and on opposing sides of the at least one signal via. The structure further includes a ground plate above and below the opening and electrically connected to the ground vias at respective ends. The structure further includes a microstrip signal via above and below the opening and electrically connected to the at least one signal via.

Abstract translation: 公开了一种用于毫米波应用的印刷电路板（PCB）和制造方法的宽带。 该结构包括多层体和多层体中的开口。 该结构还包括延伸穿过开口的至少一个信号。 所述结构还包括延伸穿过所述开口和所述至少一个信号通孔的相对侧的接地通孔。 该结构还包括在开口上方和下方的接地板，并在相应端部电连接到接地孔。 该结构还包括通过开口上方和下方并且电连接到至少一个信号通孔的微带信号。