SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS

    公开(公告)号:US20230274920A1

    公开(公告)日:2023-08-31

    申请号:US18110269

    申请日:2023-02-15

    Applicant: INTEVAC, INC.

    Abstract: A linear processing system having an entry loadlock, a first multi-pass processing chamber coupled to the entry loadlock, the first multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; a single-pass chamber coupled to the first multi-pass processing chamber and having a plurality of magnetron arrangements arranged along a carrier travel direction, the single-pass chamber configured to house multiple carriers arranged serially in a row and configured for a single-pass processing; a second multi-pass processing chamber coupled to the single-pass processing chamber, the second multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; and an exit loadlock chamber coupled to the second multi-pass processing chamber.

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