公开(公告)号：US20160322325A1

公开(公告)日：2016-11-03

申请号：US14698684

申请日：2015-04-28

Applicant: INVENSAS CORPORATION

Inventor： Reynaldo CO ,  Willmar SUBIDO ,  Hoang NGUYEN ,  Marjorie CARA ,  Wael ZOHNI ,  Christopher W. LATTIN

IPC: H01L23/00 ,  B81C1/00 ,  B23K20/00 ,  B81B7/00

CPC classification number: H01L24/49 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/05 ,  B81C1/00301 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Abstract translation: 一种装置一般涉及微机电系统部件。 在这种装置中，微机电系统部件具有下表面，上表面，第一侧表面和第二侧表面。 第一侧面的表面积大于第二侧面的表面积。 微电子机械系统部件具有多个连接到第一侧表面的第一侧表面并且远离第一侧表面的线接合线。 线接合线相对于第一侧表面的第一侧表面是自支撑的和悬臂的。