公开(公告)号：US20160322325A1

公开(公告)日：2016-11-03

申请号：US14698684

申请日：2015-04-28

Applicant: INVENSAS CORPORATION

Inventor： Reynaldo CO ,  Willmar SUBIDO ,  Hoang NGUYEN ,  Marjorie CARA ,  Wael ZOHNI ,  Christopher W. LATTIN

IPC: H01L23/00 ,  B81C1/00 ,  B23K20/00 ,  B81B7/00

CPC classification number: H01L24/49 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/05 ,  B81C1/00301 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Abstract translation: 一种装置一般涉及微机电系统部件。 在这种装置中，微机电系统部件具有下表面，上表面，第一侧表面和第二侧表面。 第一侧面的表面积大于第二侧面的表面积。 微电子机械系统部件具有多个连接到第一侧表面的第一侧表面并且远离第一侧表面的线接合线。 线接合线相对于第一侧表面的第一侧表面是自支撑的和悬臂的。

公开(公告)号：US20160262268A1

公开(公告)日：2016-09-08

申请号：US14639789

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Reynaldo CO ,  Grant VILLAVICENCIO ,  Wael ZOHNI

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract translation: 在形成微电子器件的方法中，将基底装载到模压机中。 基板具有第一表面和第二表面。 第二表面放置在模压机的内下表面上。 衬底具有从第一表面延伸到模压机的内部上表面的多个引线接合线。 模具膜的上表面被分配到模压机的内部上表面。 模具薄膜的下表面被多根线接合线的尖端刺穿，使得多个线接合线的顶端在模具薄膜的下表面上延伸到模制薄膜中。 多个线接合线的尖端朝向模制薄膜的下表面压下以使尖端弯曲。

公开(公告)号：US20160329294A1

公开(公告)日：2016-11-10

申请号：US14796745

申请日：2015-07-10

Applicant: Invensas Corporation

Inventor： Willmar SUBIDO ,  Reynaldo CO ,  Wael ZOHNI ,  Ashok S. PRABHU

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45616 ,  H01L2224/45644 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/4845 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/78301 ,  H01L2224/81815 ,  H01L2224/8501 ,  H01L2224/85014 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01008 ,  H01L2224/45664

Abstract: An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.

Abstract translation: 一种装置及其方法一般涉及集成电路封装。 在这种装置中，平台基板具有铜焊盘。 集成电路管芯耦合到平台衬底。 导线接合线将集成电路管芯的触点和铜焊盘相连。 线接合线的第一端用球接合球焊接，以直接接触铜垫的上表面。 线接合线的第二端用针脚接合到接点上。