公开(公告)号：US11577276B2

公开(公告)日：2023-02-14

申请号：US16684239

申请日：2019-11-14

Applicant: INVENSENSE, INC.

Inventor： Chienliu Chang

IPC: B06B1/06 ,  B06B1/02 ,  H01L41/04 ,  H01L41/047 ,  H01L41/053 ,  H01L41/08 ,  H01L41/29 ,  H01L41/313 ,  H01L41/332 ,  G06V40/13

Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices of a PMUT array.

公开(公告)号：US20200147644A1

公开(公告)日：2020-05-14

申请号：US16684239

申请日：2019-11-14

Applicant: INVENSENSE, INC.

Inventor： Chienliu Chang

IPC: B06B1/06 ,  B06B1/02 ,  H01L41/04 ,  H01L41/047 ,  H01L41/053 ,  H01L41/08 ,  H01L41/29 ,  H01L41/313 ,  H01L41/332 ,  G06K9/00

Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices of a PMUT array.

公开(公告)号：US20190262865A1

公开(公告)日：2019-08-29

申请号：US16269892

申请日：2019-02-07

Applicant: INVENSENSE, INC.

Inventor： Emad Mehdizadeh ,  Bongsang Kim ,  Chienliu Chang ,  Leonardo Baldasarre ,  Nikhil Apte ,  Xiaoyue Jiang ,  Mei-Lin Chan

IPC: B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/08 ,  H01L41/187 ,  H01L41/29 ,  H01L41/332 ,  H01L41/313 ,  B06B1/02

Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.

公开(公告)号：US11623246B2

公开(公告)日：2023-04-11

申请号：US16269892

申请日：2019-02-07

Applicant: INVENSENSE, INC.

Inventor： Emad Mehdizadeh ,  Bongsang Kim ,  Chienliu Chang ,  Leonardo Baldasarre ,  Nikhil Apte ,  Xiaoyue Jiang ,  Mei-Lin Chan

IPC: B06B1/06 ,  B06B1/02 ,  H01L41/04 ,  H01L41/047 ,  H01L41/08 ,  H01L41/187 ,  H01L41/29 ,  H01L41/332 ,  H01L41/313 ,  G06V40/13

Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.

公开(公告)号：US11563166B2

公开(公告)日：2023-01-24

申请号：US16812752

申请日：2020-03-09

Applicant: INVENSENSE, INC.

Inventor： Chienliu Chang

IPC: H01L41/257 ,  B06B1/02 ,  B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/193 ,  H01L41/29 ,  H01L41/332 ,  H01L41/08 ,  G06V40/13

Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied between the upper electrode and the interconnected set of lower electrodes. After poling is complete, portions of the interconnected set of lower electrodes are removed to permanently isolate permanent lower electrodes from each other.

公开(公告)号：US11515465B2

公开(公告)日：2022-11-29

申请号：US16281792

申请日：2019-02-21

Applicant: INVENSENSE, INC.

Inventor： Nikhil Apte ,  Chienliu Chang ,  Shreyas Thakar ,  Mei-Lin Chan

IPC: H01L41/047 ,  H01L41/09 ,  B06B1/06 ,  B81B7/00 ,  G01N29/24 ,  B81B3/00

Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.

公开(公告)号：US20200287126A1

公开(公告)日：2020-09-10

申请号：US16812752

申请日：2020-03-09

Applicant: INVENSENSE, INC.

Inventor： Chienliu Chang

IPC: H01L41/257 ,  B06B1/02 ,  B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/08 ,  H01L41/193 ,  H01L41/29 ,  H01L41/332 ,  G06K9/00

Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied between the upper electrode and the interconnected set of lower electrodes. After poling is complete, portions of the interconnected set of lower electrodes are removed to permanently isolate permanent lower electrodes from each other.

公开(公告)号：US20190267536A1

公开(公告)日：2019-08-29

申请号：US16281792

申请日：2019-02-21

Applicant: INVENSENSE, INC.

Inventor： Nikhil Apte ,  Chienliu Chang ,  Shreyas Thakar ,  Mei-Lin Chan

IPC: H01L41/09 ,  B06B1/06 ,  H01L41/047 ,  B81B3/00 ,  B81B7/00 ,  G01N29/24

Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.