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公开(公告)号:US11623246B2
公开(公告)日:2023-04-11
申请号:US16269892
申请日:2019-02-07
申请人: INVENSENSE, INC.
发明人: Emad Mehdizadeh , Bongsang Kim , Chienliu Chang , Leonardo Baldasarre , Nikhil Apte , Xiaoyue Jiang , Mei-Lin Chan
IPC分类号: B06B1/06 , B06B1/02 , H01L41/04 , H01L41/047 , H01L41/08 , H01L41/187 , H01L41/29 , H01L41/332 , H01L41/313 , G06V40/13
摘要: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
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公开(公告)号:US20220144624A1
公开(公告)日:2022-05-12
申请号:US17583860
申请日:2022-01-25
申请人: InvenSense, Inc.
IPC分类号: B81B3/00 , G01P15/125
摘要: A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.
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公开(公告)号:US10732196B2
公开(公告)日:2020-08-04
申请号:US15828304
申请日:2017-11-30
申请人: InvenSense, Inc.
IPC分类号: G01P15/08 , B81B7/02 , G01P15/125 , B81B5/00
摘要: A microelectromechanical (MEMS) accelerometer senses linear acceleration perpendicular to a MEMS device plane of the MEMS accelerometer based on a rotation of a proof mass out-of-plane about a rotational axis. A symmetry axis is perpendicular to the rotational axis. The proof mass includes a symmetric portion that is symmetric about the symmetry axis and that is contiguous with an asymmetric portion that is asymmetric about the symmetry axis.
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公开(公告)号:US20200158489A1
公开(公告)日:2020-05-21
申请号:US16750650
申请日:2020-01-23
申请人: INVENSENSE, INC.
发明人: Ilya Gurin , Leonardo Baldasarre
摘要: The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.
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公开(公告)号:US20190162747A1
公开(公告)日:2019-05-30
申请号:US15828304
申请日:2017-11-30
申请人: InvenSense, Inc.
摘要: A microelectromechanical (MEMS) accelerometer senses linear acceleration perpendicular to a MEMS device plane of the MEMS accelerometer based on a rotation of a proof mass out-of-plane about a rotational axis. A symmetry axis is perpendicular to the rotational axis. The proof mass includes a symmetric portion that is symmetric about the symmetry axis and that is contiguous with an asymmetric portion that is asymmetric about the symmetry axis.
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公开(公告)号:US20190113327A1
公开(公告)日:2019-04-18
申请号:US15783792
申请日:2017-10-13
申请人: INVENSENSE, INC.
发明人: Ilya Gurin , Leonardo Baldasarre
IPC分类号: G01B7/31
摘要: The present invention relates to systems and methods for measuring misalignment between layers of a semiconductor device. In one embodiment, a method includes applying an input voltage to respective ones of one or more first electrodes associated with a first conductive layer of a semiconductor device; sensing an electrical property of one or more second electrodes associated with a second conductive layer of the semiconductor device in response to applying the input voltage to the respective ones of the one or more first electrodes; and calculating a misalignment between the first conductive layer of the semiconductor device and the second conductive layer of the semiconductor device in an in-plane direction as a function of the electrical property of the one or more second electrodes.
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公开(公告)号:US11543229B2
公开(公告)日:2023-01-03
申请号:US17225464
申请日:2021-04-08
申请人: INVENSENSE, INC.
发明人: Ilya Gurin , Leonardo Baldasarre
摘要: The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.
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公开(公告)号:US20210223024A1
公开(公告)日:2021-07-22
申请号:US17225464
申请日:2021-04-08
申请人: INVENSENSE, INC.
发明人: Ilya Gurin , Leonardo Baldasarre
摘要: The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.
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公开(公告)号:US20190262865A1
公开(公告)日:2019-08-29
申请号:US16269892
申请日:2019-02-07
申请人: INVENSENSE, INC.
发明人: Emad Mehdizadeh , Bongsang Kim , Chienliu Chang , Leonardo Baldasarre , Nikhil Apte , Xiaoyue Jiang , Mei-Lin Chan
IPC分类号: B06B1/06 , H01L41/04 , H01L41/047 , H01L41/08 , H01L41/187 , H01L41/29 , H01L41/332 , H01L41/313 , B06B1/02
摘要: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
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公开(公告)号:US20190162538A1
公开(公告)日:2019-05-30
申请号:US15828323
申请日:2017-11-30
申请人: InvenSense, Inc.
IPC分类号: G01C19/5712 , G01P15/125 , B81B3/00
CPC分类号: G01C19/5712 , B81B3/0078 , B81B2201/0235 , B81B2201/0242 , G01C19/5783 , G01P15/125
摘要: A MEMS sensor includes a MEMS layer, a cap layer, and a substrate layer. The MEMS layer includes a suspended spring-mass system that moves in response to a sensed inertial force. The suspended spring-mass system is suspended from one or more anchors. The anchors are coupled to each of the cap layer and the substrate layer by anchoring components. The anchoring components are offset such that a force applied to the cap layer or the substrate layer causes a rotation of the anchor and such that the suspended spring-mass system substantially remains within the original MEMS layer.
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