-
公开(公告)号：US11847851B2
公开(公告)日：2023-12-19
申请号：US17675832
申请日：2022-02-18
申请人： INVENSENSE, INC.
CPC分类号： G06V40/1306 , B06B1/067 , B06B1/0666 , B81B7/007 , B81C1/00238 , B81C1/00246 , B81C1/00301 , G01H11/08 , B06B2201/70 , B81B2201/0271 , B81B2201/032 , B81B2203/0127 , B81B2207/012 , B81B2207/015 , B81C2201/0105 , B81C2201/0109 , B81C2203/035 , B81C2203/036 , B81C2203/0792
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
公开(公告)号：US20200250393A1
公开(公告)日：2020-08-06
申请号：US16805555
申请日：2020-02-28
申请人： INVENSENSE, INC.
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
公开(公告)号：US20220172506A1
公开(公告)日：2022-06-02
申请号：US17675832
申请日：2022-02-18
申请人： INVENSENSE, INC.
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
公开(公告)号：US11263424B2
公开(公告)日：2022-03-01
申请号：US16805555
申请日：2020-02-28
申请人： INVENSENSE, INC.
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
公开(公告)号：US10726231B2
公开(公告)日：2020-07-28
申请号：US15853396
申请日：2017-12-22
申请人： INVENSENSE, INC.
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
公开(公告)号：US20180107854A1
公开(公告)日：2018-04-19
申请号：US15853396
申请日：2017-12-22
申请人： INVENSENSE, INC.
CPC分类号： G06K9/0002 , B06B1/0666 , B06B1/067 , B06B2201/70 , B81B7/007 , B81B2201/0271 , B81B2201/032 , B81B2203/0127 , B81B2207/012 , B81B2207/015 , B81C1/00238 , B81C1/00246 , B81C1/00301 , B81C2201/0105 , B81C2201/0109 , B81C2203/035 , B81C2203/036 , B81C2203/0792 , G01H11/08
摘要： Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.012 秒)
