公开(公告)号：US20230348708A1

公开(公告)日：2023-11-02

申请号：US18075967

申请日：2022-12-06

Applicant: ITEQ CORPORATION

Inventor： Sheng-Yen WU ,  Tzu-Fang CHEN ,  Po-Kai TSENG ,  Yu-Chieh HSU ,  Te-Chieh LI ,  Shao-Wei YU

IPC: C08L63/00 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20

CPC classification number: C08L63/00 ,  C08J5/244 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08J2363/00 ,  C08J2451/06 ,  C08J2479/08 ,  C08L2205/03 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2250/05 ,  B32B2250/40

Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.