公开(公告)号：US20230348708A1

公开(公告)日：2023-11-02

申请号：US18075967

申请日：2022-12-06

Applicant: ITEQ CORPORATION

Inventor： Sheng-Yen WU ,  Tzu-Fang CHEN ,  Po-Kai TSENG ,  Yu-Chieh HSU ,  Te-Chieh LI ,  Shao-Wei YU

IPC: C08L63/00 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20

CPC classification number: C08L63/00 ,  C08J5/244 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08J2363/00 ,  C08J2451/06 ,  C08J2479/08 ,  C08L2205/03 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2250/05 ,  B32B2250/40

Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.

公开(公告)号：US20180223094A1

公开(公告)日：2018-08-09

申请号：US15807163

申请日：2017-11-08

Applicant: ITEQ CORPORATION

Inventor： Kai-Yang CHEN ,  Chun-Hao CHANG ,  Yu-Chieh HSU

IPC: C08L63/00 ,  C08G59/40 ,  H01B3/40 ,  H01B3/30

CPC classification number: C08L63/00 ,  C08G59/4071 ,  C08G59/4223 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/02 ,  C08L2205/03 ,  H01B3/303 ,  H01B3/40 ,  C08K3/36 ,  C08K5/0066 ,  C08L79/08

Abstract: The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.