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公开(公告)号:US11718065B2
公开(公告)日:2023-08-08
申请号:US14774947
申请日:2014-03-12
Applicant: ImerTech SAS
IPC: B32B5/26 , B32B5/02 , D04H1/413 , D04H3/16 , D04H3/14 , B32B5/08 , D01D5/098 , D01F6/06 , D01F1/10
CPC classification number: B32B5/26 , B32B5/022 , B32B5/08 , D04H1/413 , D04H3/14 , D04H3/16 , B32B2250/03 , B32B2250/05 , B32B2250/20 , B32B2250/24 , B32B2250/40 , B32B2262/0253 , B32B2262/0261 , B32B2262/0276 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2264/12 , B32B2305/20 , B32B2307/54 , B32B2307/718 , B32B2307/724 , B32B2307/7265 , B32B2307/73 , B32B2437/02 , B32B2535/00 , B32B2555/02 , D01D5/0985 , D01F1/10 , D01F6/06
Abstract: A composite structure may include at least two nonwoven, polymeric layers bonded to each other. At least one nonwoven, polymeric layer may include inorganic particulate filler in an amount up to about 40% by weight of the nonwoven layer.