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    LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS
    1.
    发明申请
    LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS 有权

    公开(公告)号：US20220184749A1

    公开(公告)日：2022-06-16

    申请号：US17688735

    申请日：2022-03-07

    申请人： INDIUM CORPORATION

    发明人： Hongwen Zhang ,  Fen Chen ,  Francis Mutuku ,  Jie Geng ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  C22C13/02 ,  B23K35/02 ,  B23K1/008

    摘要： Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

    HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS
    2.
    发明申请
    HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS 审中-公开

    公开(公告)号：US20200269360A1

    公开(公告)日：2020-08-27

    申请号：US16801556

    申请日：2020-02-26

    申请人： INDIUM CORPORATION

    发明人： Jie Geng ,  Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  B23K35/02

    摘要： High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

    High reliability leadfree solder alloys for harsh service conditions
    4.
    发明授权
    High reliability leadfree solder alloys for harsh service conditions 有权

    公开(公告)号：US11752579B2

    公开(公告)日：2023-09-12

    申请号：US16801556

    申请日：2020-02-26

    申请人： INDIUM CORPORATION

    发明人： Jie Geng ,  Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  B23K35/02 ,  H05K1/18 ,  B23K101/42 ,  B23K103/08

    CPC分类号： B23K35/262 ,  B23K35/025 ,  H05K1/181 ,  B23K2101/42 ,  B23K2103/08

    摘要： High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

    HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY POWDERS
    5.
    发明申请
    HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY POWDERS 有权

    公开(公告)号：US20220395936A1

    公开(公告)日：2022-12-15

    申请号：US17834666

    申请日：2022-06-07

    申请人： INDIUM CORPORATION

    发明人： Jie Geng ,  Hongwen Zhang

    IPC分类号： B23K35/26 ,  B23K35/02 ,  C22C13/02

    摘要： Some implementations of the disclosure describe a solder paste consisting essentially of: 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of a Sn—Sb alloy, a Sn—Ag—Cu—Sb alloy, a Sn—Ag—Cu—Sb—In alloy, a Sn—Ag—Cu—Sb—Bi alloy, or Sn—Ag—Cu—Sb—Bi—In alloy; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn—Ag—Cu alloy or Sn—Ag—Cu—Bi alloy, and the second solder alloy powder having a lower solidus temperature than the first solder alloy powder; and flux.

    Hybrid lead-free solder wire
    7.
    发明授权
    Hybrid lead-free solder wire 有权

    公开(公告)号：US09802274B2

    公开(公告)日：2017-10-31

    申请号：US15076386

    申请日：2016-03-21

    申请人： Indium Corporation

    发明人： Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K31/02 ,  B23K35/26 ,  B23K35/02 ,  C22C12/00

    CPC分类号： B23K35/264 ,  B23K35/0227 ,  C22C12/00

    摘要： A lead-free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.

    SNBI AND SNIN SOLDER ALLOYS
    9.
    发明申请
    SNBI AND SNIN SOLDER ALLOYS 审中-公开

    公开(公告)号：US20200070287A1

    公开(公告)日：2020-03-05

    申请号：US16557587

    申请日：2019-08-30

    申请人： INDIUM CORPORATION

    发明人： Francis M. Mutuku ,  Ning-Cheng Lee ,  Hongwen Zhang

    IPC分类号： B23K35/26 ,  C22C13/02 ,  C22C12/00

    摘要： Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60 wt % Bi; optionally, one or more of: up to 16 wt % In, up to 4.5 wt % Ag, up to 2 wt % Cu, up to 12 wt % Sb, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn. A Snln solder alloy may consist of: 8 to 20 wt % In; optionally, one or more of: up to 12 wt % Bi, up to 4 wt % Ag, up to 5 wt % Sb, up to 3 wt % Cu, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn.

    Mixed alloy solder paste
    10.
    发明授权
    Mixed alloy solder paste 有权

    公开(公告)号：US10118260B2

    公开(公告)日：2018-11-06

    申请号：US14629139

    申请日：2015-02-23

    申请人： Indium Corporation

    发明人： Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  C22C12/00 ,  H05K3/34

    摘要： A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.