公开(公告)号：US11803052B2

公开(公告)日：2023-10-31

申请号：US17229846

申请日：2021-04-13

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Chun-Wen Chu ,  Ching-Ya Yeh

IPC: G02B27/00 ,  G02B27/01

CPC classification number: G02B27/0093 ,  G02B27/0172 ,  G02B2027/014

Abstract: A head-mounted eye tracking system including an optical combiner, an eye tracker and a signal processor is provided. The optical combiner includes an optical coupler. The eye tracker is at least partially disposed on the optical combiner and is suitable for sensing an eyeball movement of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are suitable for emitting tracking beams. The plurality of sensing devices are suitable for receiving the tracking beams reflected by the eyeball of the wearer. The signal processor is signally connected to the eye tracker.

公开(公告)号：US20220206294A1

公开(公告)日：2022-06-30

申请号：US17229846

申请日：2021-04-13

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Jhih Luo ,  Chia-Hsin Chao ,  Chun-Wen Chu ,  Ching-Ya Yeh

IPC: G02B27/00 ,  G02B27/01

Abstract: A head-mounted eye tracking system including an optical combiner, an eye tracker and a signal processor is provided. The optical combiner includes an optical coupler. The eye tracker is at least partially disposed on the optical combiner and is suitable for sensing an eyeball movement of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are suitable for emitting tracking beams. The plurality of sensing devices are suitable for receiving the tracking beams reflected by the eyeball of the wearer. The signal processor is signally connected to the eye tracker.

公开(公告)号：US10134709B1

公开(公告)日：2018-11-20

申请号：US15849692

申请日：2017-12-21

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yao-Jun Tsai ,  Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Yi-Chen Lin ,  Ching-Ya Yeh

IPC: H01L25/16 ,  H01L25/065 ,  H01L33/62 ,  H01L33/58 ,  H01L33/50 ,  H01L33/00 ,  H01L33/54

Abstract: A light emitting diode package including a circuit layer, a light-shielding layer, a plurality of light emitting diodes and an encapsulation layer is provided. A thickness of the circuit layer is less than 100 μm. The light-shielding layer is disposed on a first surface of the circuit layer and the light-shielding layer has a plurality of apertures. The light emitting diodes are disposed on the first surface of the circuit layer and in the apertures of the light-shielding layer. The light emitting diodes are electrically connected to the circuit layer. The encapsulation layer covers the light-shielding layer. A refractive index of the encapsulation layer is 1.4 and to 1.7. The Young's modulus of the encapsulation layer is larger than or equal to 1 GPa. A thickness of the encapsulation layer is greater than thicknesses of the light emitting diodes.