-
公开(公告)号：US10654150B2
公开(公告)日：2020-05-19
申请号：US15853965
申请日：2017-12-26
Applicant: Industrial Technology Research Institute
Inventor： Wei-Chien Tsai , Hao-Wen Cheng , Jin-Bao Wu , Ming-Sheng Leu
Abstract: A grinding disk and a method of manufacturing the same are provided. The grinding disk includes a graphite base and a silicon carbide film, the silicon carbide film covering the graphite base, and the silicon carbide film has a surface grain size of 5 μm to 80 μm. By a hot-wall chemical vapor deposition system, a highly dense silicon carbide film is formed on a surface of the graphite base. The grinding disk may replace a conventional metallographic grinding and polishing disk, and is improved in characteristics such as hydrophobicity and abrasion resistance.
-
公开(公告)号：US20170176117A1
公开(公告)日：2017-06-22
申请号：US14981970
申请日：2015-12-29
Applicant: Industrial Technology Research Institute
Inventor： Jin-Bao Wu , Wei-Chien Tsai , Hao-Wen Cheng , Ming-Sheng Leu , Jia-Jen Chang , Hsien-Lin Hu
IPC: F28F21/02
CPC classification number: F28F21/02 , F28D2021/0029 , F28F2275/025 , H01L23/373 , H01L23/3737
Abstract: A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.
-
公开(公告)号：US20240217868A1
公开(公告)日：2024-07-04
申请号：US18090505
申请日：2022-12-29
Applicant: Industrial Technology Research Institute
Inventor： Hao-Wen Cheng , Ming-Huei Yen , Wen-Jin Li , Yu-Ting Guan , Ding-Shiang Wang
IPC: C03C15/00 , H01L21/3213
CPC classification number: C03C15/00 , H01L21/32134
Abstract: A method of performing a selective etch on an array substrate including the following is provided, and the array substrate includes a substrate and a component layer disposed on the substrate. Deionized water, hydrogen peroxide, and an acid are mixed to prepare a first solution, and the acid includes sulfuric acid, hydrochloric acid, oxalic acid or a combination thereof. An alkoxy silane compound is added to the first solution to prepare a second solution. The array substrate is placed into the second solution to remove the component layer, and an aging second solution is formed. The substrate is taken out from the aging second solution.
-
公开(公告)号：US20190193247A1
公开(公告)日：2019-06-27
申请号：US15853965
申请日：2017-12-26
Applicant: Industrial Technology Research Institute
Inventor： Wei-Chien Tsai , Hao-Wen Cheng , Jin-Bao Wu , Ming-Sheng Leu
CPC classification number: B24D18/00 , C23C16/325 , C23C16/52 , C23C16/56
Abstract: A grinding disk and a method of manufacturing the same are provided. The grinding disk includes a graphite base and a silicon carbide film, the silicon carbide film covering the graphite base, and the silicon carbide film has a surface grain size of 5 μm to 80 μm. By a hot-wall chemical vapor deposition system, a highly dense silicon carbide film is formed on a surface of the graphite base. The grinding disk may replace a conventional metallographic grinding and polishing disk, and is improved in characteristics such as hydrophobicity and abrasion resistance.
-
-
-
Search Results
4
records
(took 0.015 seconds)
