Abstract:
A roller assembly for transporting a substrate includes a step roller and a plurality of first auxiliary rollers. The step roller includes a main roller, and a pair of edge rollers sleeved on the main roller and located on two opposite ends of the main roller, respectively. The plurality of first auxiliary rollers are disposed on two opposite sides of the step roller, respectively. A first film forms a closed loop through the first film being rolled on the plurality of first auxiliary rollers and the step roller cyclically. A method using the same is also provided.
Abstract:
A substrate conveying device and a deposition apparatus are provided. The substrate conveying device includes a transmission shaft, a plurality of conveying rollers, and a plurality of bearings. The conveying rollers are configured to convey a substrate respectively. Each conveying roller is assembled to the transmission shaft via the corresponding bearing. Each bearing includes a stator and a rotator. Each conveying roller is fixed to the corresponding rotator. The stators are fixed to the transmission shaft. A magnetic repulsion force parallel to an axial direction of the transmission shaft exists between the stator and the rotator. The stator drives the rotator to rotate via a friction force generated by the magnetic repulsion force between the stator and the rotator.
Abstract:
A roller assembly for transporting a substrate includes a step roller, a first transport roller, and a second transport roller. The step roller includes a main roller, an air cylinder, and a pair of edge rollers. The air cylinder is sleeved on the main roller, and includes a plurality of air jetting holes and a plurality of air suction holes. The edge rollers are disposed on the main roller and are located on opposite ends of the air cylinder. The first transport roller and the second transport roller are disposed on opposite sides of the step roller, wherein the substrate is transported from the first transport roller to the second transport roller through the step roller. A method using the same is also provided.
Abstract:
A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.
Abstract:
An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.
Abstract:
An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.
Abstract:
A roller assembly for transporting a substrate includes a step roller and a plurality of first auxiliary rollers. The step roller includes a main roller, and a pair of edge rollers sleeved on the main roller and located on two opposite ends of the main roller, respectively. The plurality of first auxiliary rollers are disposed on two opposite sides of the step roller, respectively. A first film forms a closed loop through the first film being rolled on the plurality of first auxiliary rollers and the step roller cyclically. A method using the same is also provided.
Abstract:
A film thickness monitoring system is provided. The film thickness monitoring system includes a source, a valve, and a chamber. The source is configured to provide a deposition material. The valve is connected to the source. The chamber includes a manifold, a quartz crystal microbalance, and a pressure sensor. The manifold is connected to the valve and has at least one first nozzle and at least one second nozzle. The quartz crystal microbalance is disposed opposite to the at least one second nozzle. The deposition material is adapted to be deposited on the quartz crystal microbalance through the at least one second nozzle, and the quartz crystal microbalance includes a shutter facing the at least one second nozzle. The pressure sensor is disposed in the manifold. A method for monitoring a film thickness deposition process is also provided.
Abstract:
A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.
Abstract:
A film thickness monitoring system is provided. The film thickness monitoring system includes a source, a valve, and a chamber. The source is configured to provide a deposition material. The valve is connected to the source. The chamber includes a manifold, a quartz crystal microbalance, and a pressure sensor. The manifold is connected to the valve and has at least one first nozzle and at least one second nozzle. The quartz crystal microbalance is disposed opposite to the at least one second nozzle. The deposition material is adapted to be deposited on the quartz crystal microbalance through the at least one second nozzle, and the quartz crystal microbalance includes a shutter facing the at least one second nozzle. The pressure sensor is disposed in the manifold. A method for monitoring a film thickness deposition process is also provided.