POWER MODULE
    1.
    发明公开
    POWER MODULE 审中-公开

    公开(公告)号:US20240162114A1

    公开(公告)日:2024-05-16

    申请号:US18166496

    申请日:2023-02-09

    CPC classification number: H01L23/427 H01L23/49894 H01L24/32

    Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

    POWER INTEGRATED MODULE AND MOTOR CONTROL SYSTEM

    公开(公告)号:US20240266985A1

    公开(公告)日:2024-08-08

    申请号:US18307794

    申请日:2023-04-26

    Abstract: A power integrated module (PIM) and a motor control system are provided. The PIM is adapted to drive a motor. The PIM includes a first transformation circuit, a second transformation circuit, and a plurality of shunt units. The first transformation circuit includes a plurality of first half-bridge circuits, and a coupling relationship among the first half-bridge circuits is selected, so that the first transformation circuit is operated in a rectifier mode or an inverter mode. The second transformation circuit includes a plurality of second half-bridge circuits coupled to the motor. The shunt units are respectively coupled between the second half-bridge circuits and the motor and configured to sense a current between the second transformation circuit and the motor.

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