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    Method of electrically isolating shared leads of a lead frame strip
    1.
    发明授权
    Method of electrically isolating shared leads of a lead frame strip 有权
    电隔离引线框带的共用引线的方法

    公开(公告)号：US09324642B2

    公开(公告)日：2016-04-26

    申请号：US14077582

    申请日：2013-11-12

    Applicant: Infineon Technologies AG

    Inventor： Frank Püschner ,  Bernhard Schätzler ,  Teck Sim Lee ,  Franz Gabler ,  Pei Pei Kong ,  Boon Huat Lim

    IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56 ,  H01L23/31

    CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

    Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

    Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯附接到管芯片。 模制化合物覆盖包括半导体管芯的单元引线框架。 在引线框架条的测试或其它处理之前，间隙被蚀刻到由相邻单元引线框架共享的引线的区域中。 差距至少主要通过共享潜在客户。 在随后的处理之前，在包括在共享引线之间的间隙的下方的单元引线框的周围的模塑料中部分地切割，以使单元引线框架的引线电隔离。

    Method of Electrically Isolating Shared Leads of a Lead Frame Strip
    2.
    发明申请
    Method of Electrically Isolating Shared Leads of a Lead Frame Strip 有权
    电气隔离引线框架带状共用引线的方法

    公开(公告)号：US20150130037A1

    公开(公告)日：2015-05-14

    申请号：US14077582

    申请日：2013-11-12

    Applicant: Infineon Technologies AG

    Inventor： Frank Püschner ,  Bernhard Schätzler ,  Teck Sim Lee ,  Franz Gabler ,  Pei Pei Kong ,  Boon Huat Lim

    IPC: H01L23/495 ,  H01L21/48 ,  H01L21/66

    CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

    Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

    Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯附接到管芯片。 模制化合物覆盖包括半导体管芯的单元引线框架。 在引线框架条的测试或其它处理之前，间隙被蚀刻到由相邻单元引线框架共享的引线的区域中。 差距至少主要通过共享潜在客户。 在随后的处理之前，在包括在共享引线之间的间隙的下方的单元引线框的周围的模塑料中进行部分切割以使单元引线框架的引线电隔离。

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