公开(公告)号：US08637977B2

公开(公告)日：2014-01-28

申请号：US13928835

申请日：2013-06-27

Applicant: Infineon Technologies AG

Inventor： Boon Huat Lim ,  Chee Chian Lim ,  Yoke Chin Goh

IPC: H01L23/48

CPC classification number: H01L24/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/40095 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract translation: 公开了一种用夹子封装半导体器件的方法和装置。 夹子限定在至少一个夹子的同一面上的第一接触区域和第二接触区域。 芯片限定第一面和与第一面相反的第二面，第一接触区域附接到芯片的第一面，第二接触区域位于与夹子的第二面相同的平面内。

公开(公告)号：US08907501B2

公开(公告)日：2014-12-09

申请号：US14030825

申请日：2013-09-18

Applicant: Infineon Technologies AG

Inventor： Chee Chian Lim

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/3164 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/83191 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads.

Abstract translation: 公开了一种将管芯附接到衬底的方法。 芯片的主表面具有电触头阵列，并且覆盖有具有与触点对准的孔阵列的带段。 焊球插入孔中。 模具靠着衬底定位，焊球与衬底表面上的焊盘对准，并且执行热处理工艺以将导电元件粘合到相应的焊盘上。

公开(公告)号：US20150091195A1

公开(公告)日：2015-04-02

申请号：US14563661

申请日：2014-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Chee Chian Lim

IPC: H01L23/00

CPC classification number: H01L24/50 ,  H01L23/3164 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/83191 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads.

公开(公告)号：US20140015134A1

公开(公告)日：2014-01-16

申请号：US14030825

申请日：2013-09-18

Applicant: Infineon Technologies AG

Inventor： Chee Chian Lim

IPC: H01L23/00

CPC classification number: H01L24/50 ,  H01L23/3164 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/83191 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads.

Abstract translation: 公开了一种将管芯附接到衬底的方法。 芯片的主表面具有电触头阵列，并且覆盖有具有与触点对准的孔阵列的带段。 焊球插入孔中。 模具靠着衬底定位，焊球与衬底表面上的焊盘对准，并且执行热处理工艺以将导电元件粘合到相应的焊盘上。

公开(公告)号：US20130285249A1

公开(公告)日：2013-10-31

申请号：US13928835

申请日：2013-06-27

Applicant: Infineon Technologies AG

Inventor： Boon Huat Lim ,  Chee Chian Lim ,  Yoke Chin Goh

IPC: H01L23/00

CPC classification number: H01L24/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/40095 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract translation: 公开了一种用夹子封装半导体器件的方法和装置。 夹子限定在至少一个夹子的同一面上的第一接触区域和第二接触区域。 芯片限定第一面和与第一面相反的第二面，第一接触区域附接到芯片的第一面，第二接触区域位于与夹子的第二面相同的平面内。