公开(公告)号：US20230170286A1

公开(公告)日：2023-06-01

申请号：US18070092

申请日：2022-11-28

Applicant: Infineon Technologies AG

Inventor： Arthur Unrau ,  Florian Dreps ,  Christoph Koch ,  Till Neddermann ,  Christian Steininger

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L25/18 ,  H01L23/053 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L23/5383 ,  H01L25/072 ,  H01L25/18 ,  H01L23/053 ,  H01L21/4842 ,  H01L24/73

Abstract: A terminal element or bus bar for a power semiconductor module arrangement includes a first end configured to be arranged inside a housing of the power semiconductor module arrangement, a second end configured to be arranged outside of the housing of the power semiconductor module arrangement, and at least a first section and a second section arranged successively between the first end and the second end along a length of the terminal element or bus bar, wherein either the first section includes a first material, the second section includes a second material, and the first material differs from the second material, or the first section has a first thickness, the second section has a second thickness, and the first thickness differs from the second thickness, or both.

公开(公告)号：US20240162048A1

公开(公告)日：2024-05-16

申请号：US18505558

申请日：2023-11-09

Applicant: Infineon Technologies AG

Inventor： Lukas Meis ,  Guido Strotmann ,  Florian Dreps

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4846 ,  H01L23/49811 ,  H01L25/072

Abstract: A method includes exerting a pressing force on a section of a first surface of a metal layer by a punch. Either the metal layer is arranged on a working surface with a second surface of the metal layer facing the working surface, the second surface being arranged opposite the first surface, and the punch is pressed against the section of the first surface with a pressing force that forces material of the metal layer to flow up against a stroke of the punch, thereby forming a sleeve extending from the first surface in a vertical direction and away from the second surface, or the punch is pressed against the section of the first surface and forced through the metal layer towards the second surface with a pressing force that forces material of the metal layer to flow down with a stroke of the punch, thereby forming a sleeve extending from the second surface in a vertical direction and away from the first surface. The method further includes, after forming the sleeve, arranging the metal layer in a housing of a power semiconductor module.