-
公开(公告)号:US20220347786A1
公开(公告)日:2022-11-03
申请号:US17245182
申请日:2021-04-30
Applicant: Infineon Technologies AG
Inventor: Till Neddermann , Michal Chajneta , Alparslan Takkac
IPC: B23K20/10
Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
-
公开(公告)号:US12109645B2
公开(公告)日:2024-10-08
申请号:US18235428
申请日:2023-08-18
Applicant: Infineon Technologies AG
Inventor: Till Neddermann , Michal Chajneta , Alparslan Takkac
IPC: B23K20/00 , B23K20/10 , B23K101/36 , B23K103/12
CPC classification number: B23K20/106 , B23K2101/36 , B23K2103/12
Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
-
3.
公开(公告)号:US20230170286A1
公开(公告)日:2023-06-01
申请号:US18070092
申请日:2022-11-28
Applicant: Infineon Technologies AG
Inventor: Arthur Unrau , Florian Dreps , Christoph Koch , Till Neddermann , Christian Steininger
IPC: H01L23/498 , H01L23/538 , H01L25/07 , H01L25/18 , H01L23/053 , H01L21/48
CPC classification number: H01L23/49811 , H01L23/5383 , H01L25/072 , H01L25/18 , H01L23/053 , H01L21/4842 , H01L24/73
Abstract: A terminal element or bus bar for a power semiconductor module arrangement includes a first end configured to be arranged inside a housing of the power semiconductor module arrangement, a second end configured to be arranged outside of the housing of the power semiconductor module arrangement, and at least a first section and a second section arranged successively between the first end and the second end along a length of the terminal element or bus bar, wherein either the first section includes a first material, the second section includes a second material, and the first material differs from the second material, or the first section has a first thickness, the second section has a second thickness, and the first thickness differs from the second thickness, or both.
-
公开(公告)号:US20230390859A1
公开(公告)日:2023-12-07
申请号:US18235428
申请日:2023-08-18
Applicant: Infineon Technologies AG
Inventor: Till Neddermann , Michal Chajneta , Alparslan Takkac
IPC: B23K20/10
CPC classification number: B23K20/106 , B23K2103/12
Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
-
公开(公告)号:US11772187B2
公开(公告)日:2023-10-03
申请号:US17245182
申请日:2021-04-30
Applicant: Infineon Technologies AG
Inventor: Till Neddermann , Michal Chajneta , Alparslan Takkac
IPC: B23K20/00 , B23K20/10 , B23K103/12 , B23K101/36
CPC classification number: B23K20/106 , B23K2101/36 , B23K2103/12
Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
-
-
-
-