TRANSISTOR ARRANGEMENT AND METHOD FOR MEASURING AN ON- RESISTANCE OF A TRANSISTOR ARRANGEMENT

    公开(公告)号:US20250130270A1

    公开(公告)日:2025-04-24

    申请号:US18908105

    申请日:2024-10-07

    Abstract: A transistor arrangement is disclosed. The transistor arrangement includes a first transistor device and a second transistor device each including a load path and a control node, and each at least partially integrated in a semiconductor body. The load paths of the first and second transistor devices are connected in parallel. The transistor arrangement further includes a first control pad connected to the control node of the first transistor device through a first resistor, and a second control pad connected to the control node of the second transistor device and connected to the first control pad through a second resistor.

    RC snubber with poly silicon resistor and capacitor formed from junction termination edge

    公开(公告)号:US12278231B2

    公开(公告)日:2025-04-15

    申请号:US17692509

    申请日:2022-03-11

    Abstract: An apparatus includes a junction termination edge, a unipolar power transistor, and an RC snubber. The RC snubber has a capacitor between a poly silicon structure and a semiconductor substrate, and part of the junction termination edge. The capacitor has a p-n junction. The RC snubber has a poly silicon resistor between a source of the unipolar power transistor and a first layer forming the capacitor. The unipolar transistor and the RC snubber are coupled in parallel. The RC snubber and the unipolar power transistor are formed monolithically on the semiconductor substrate.

    SEMICONDUCTOR DEVICE WITH DIODE CHAIN CONNECTED TO GATE METALLIZATION

    公开(公告)号:US20220406928A1

    公开(公告)日:2022-12-22

    申请号:US17838490

    申请日:2022-06-13

    Abstract: A semiconductor device includes a transistor cell with a source region of a first conductivity type and a gate electrode. The source region is formed in a wide bandgap semiconductor portion. A diode chain includes a plurality of diode structures. The diode structures are formed in the wide bandgap semiconductor portion and electrically connected in series. Each diode structure includes a cathode region of the first conductivity type and an anode region of a complementary second conductivity type. A gate metallization is electrically connected with the gate electrode and with a first one of the anode regions in the diode chain. A source electrode structure is electrically connected with the source region and with a last one of the cathode regions in the diode chain.

    VERTICAL POWER SEMICONDUCTOR DEVICE
    5.
    发明公开

    公开(公告)号:US20240290878A1

    公开(公告)日:2024-08-29

    申请号:US18585167

    申请日:2024-02-23

    CPC classification number: H01L29/7811 H01L29/66734

    Abstract: A vertical power semiconductor device includes a semiconductor body having first and second opposite surfaces. A subdivision of an area of the semiconductor body at the first surface includes: a transistor cell area having transistor cells in the semiconductor body; an edge termination area surrounding the transistor cell area, the semiconductor body including a termination structure in the edge termination area; a gate line area between the transistor cell area and the edge termination area, the gate line area including a gate line over the semiconductor body; and a source or emitter line area between the gate line area and the edge termination area. The source or emitter line area includes transistor cells in the semiconductor body, and a source or emitter line over the semiconductor body.

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