公开(公告)号：US20240347427A1

公开(公告)日：2024-10-17

申请号：US18598163

申请日：2024-03-07

Applicant: Infineon Technologies AG

Inventor： Edward FÜRGUT ,  Teck Sim LEE ,  Guey Yong CHEE ,  Thai Kee GAN ,  Thomas BEMMERL ,  Markus FINK

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/49555 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/08 ,  H01L25/072 ,  H01L2224/08221 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. The external portion is configured to be used for external electrical connection. In another example, a semiconductor package having a leadframe is disclosed.