公开(公告)号：US20220108949A1

公开(公告)日：2022-04-07

申请号：US17064954

申请日：2020-10-07

Applicant: Infineon Technologies AG

Inventor： Lee Shuang WANG ,  Thai Kee GAN ,  Teck Sim LEE

IPC: H01L23/528 ,  H01L23/31 ,  H01L43/04 ,  G01R33/09 ,  G01R33/07

Abstract: One example of a semiconductor package includes a first die pad, a first die, a second die pad, and a second die. The first die pad includes a main portion and a U-shaped rail portion extending from the main portion. The first die is electrically coupled to the first die pad. The second die pad is proximate the U-shaped rail portion of the first die pad. The second die is electrically coupled to the second die pad. The second die includes a magnetic field sensor.

公开(公告)号：US20240347427A1

公开(公告)日：2024-10-17

申请号：US18598163

申请日：2024-03-07

Applicant: Infineon Technologies AG

Inventor： Edward FÜRGUT ,  Teck Sim LEE ,  Guey Yong CHEE ,  Thai Kee GAN ,  Thomas BEMMERL ,  Markus FINK

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/49555 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/08 ,  H01L25/072 ,  H01L2224/08221 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. The external portion is configured to be used for external electrical connection. In another example, a semiconductor package having a leadframe is disclosed.