公开(公告)号：US11712749B2

公开(公告)日：2023-08-01

申请号：US16986411

申请日：2020-08-06

Applicant: Infineon Technologies AG

Inventor： Ralf Rieske ,  Alexander Binter ,  Wolfgang Diewald ,  Bernhard Goller ,  Heimo Graf ,  Gerald Lackner ,  Jan Richter ,  Roland Rupp ,  Guenter Schagerl ,  Marko Swoboda

IPC: B23K26/0622 ,  H01L21/02 ,  B23K26/00 ,  H01L21/78

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  H01L21/02378 ,  H01L21/7813

Abstract: Provided is a parent substrate that includes a central region and an edge region. The edge region surrounds the central region. A detachment layer is formed in the central region. The detachment layer extends parallel to a main surface of the parent substrate. The detachment layer includes modified substrate material. A groove is formed in the edge region. The groove laterally encloses the central region. The groove runs vertically and/or tilted to the detachment layer.

公开(公告)号：US20230330769A1

公开(公告)日：2023-10-19

申请号：US18336643

申请日：2023-06-16

Applicant: Infineon Technologies AG

Inventor： Ralf Rieske ,  Alexander Binter ,  Wolfgang Diewald ,  Bernhard Goller ,  Heimo Graf ,  Gerald Lackner ,  Jan Richter ,  Roland Rupp ,  Guenter Schagerl ,  Marko David Swoboda

IPC: B23K26/0622 ,  H01L21/02 ,  B23K26/00 ,  H01L21/78

CPC classification number: B23K26/0624 ,  H01L21/02378 ,  B23K26/0006 ,  H01L21/7813

Abstract: Provided is a machining apparatus including a profile sensor unit configured to obtain shape information about a parent substrate; and a laser scan unit configured to direct a laser beam onto the parent substrate, wherein a laser beam axis of the laser beam is tilted to an exposed main surface of the parent substrate, and wherein a track of the laser beam on the parent substrate is controllable as a function of the shape information obtained from the profile sensor unit.

公开(公告)号：US20210053148A1

公开(公告)日：2021-02-25

申请号：US16986411

申请日：2020-08-06

Applicant: Infineon Technologies AG

Inventor： Ralf Rieske ,  Alexander Binter ,  Wolfgang Diewald ,  Bernhard Goller ,  Heimo Graf ,  Gerald Lackner ,  Jan Richter ,  Roland Rupp ,  Guenter Schagerl ,  Marko Swoboda

IPC: B23K26/0622 ,  H01L21/78 ,  B23K26/00 ,  H01L21/02

Abstract: Provided is a parent substrate that includes a central region and an edge region. The edge region surrounds the central region. A detachment layer is formed in the central region. The detachment layer extends parallel to a main surface of the parent substrate. The detachment layer includes modified substrate material. A groove is formed in the edge region. The groove laterally encloses the central region. The groove runs vertically and/or tilted to the detachment layer.