公开(公告)号：US20230170329A1

公开(公告)日：2023-06-01

申请号：US17888669

申请日：2022-08-16

Applicant: Infineon Technologies AG

Inventor： Sock Chien Tey ,  Keck Tim Ang ,  Chan Lam Cha ,  Chau Fatt Chiang ,  Badrul Hisyam Ismail ,  Desmond Jenn Yong Loo ,  Ronizan Mohd Salleh ,  Norliza Morban ,  Si Hao Vincent Yeo ,  Chee Mun Wai ,  Fee Hoon Wendy Wong

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/482 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/4824 ,  H01L24/16 ,  H01L23/5386 ,  H01L24/32 ,  H01L21/568 ,  H01L25/50 ,  H01L2224/16157 ,  H01L2224/32145

Abstract: A method of forming a semiconductor package includes providing a metal baseplate including a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.