公开(公告)号：US20140117515A1

公开(公告)日：2014-05-01

申请号：US14148585

申请日：2014-01-06

Applicant: Infineon Technologies AG

Inventor： Rudolf LACHNER ,  Linus MAURER ,  Maciej WOJNOWSKI

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/12 ,  H01L24/19 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q9/0457 ,  H01L2924/00

Abstract: A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.

Abstract translation: 半导体模块包括晶片封装，其包括嵌入在晶片封装内的集成电路（IC）器件和包括至少一个天线结构和再分配结构的层，其中天线结构耦合到IC器件，并且其中再分配结构耦合 到IC设备。

公开(公告)号：US20130207262A1

公开(公告)日：2013-08-15

申请号：US13849034

申请日：2013-03-22

Applicant: Infineon Technologies AG

Inventor： Rudolf LACHNER ,  Linus MAURER ,  Maciej WOJNOWSKI

IPC: H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/12 ,  H01L24/19 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q9/0457 ,  H01L2924/00

Abstract: A semiconductor module, comprises a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound, the integrated circuit device and the package molding compound having a common surface. Structures are formed to connect the semiconductor module to an external board, the structures electrically connected to the integrated circuit device. A layer is formed on the common surface, the layer comprising at least one integrated antenna structure, the integrated antenna structure being coupled to the IC device.

Abstract translation: 半导体模块包括封装模制化合物层，其包含嵌入封装模塑料中的集成电路（IC）器件，集成电路器件和具有共同表面的封装模塑料。 形成结构以将半导体模块连接到外部板，该结构电连接到集成电路器件。 在公共表面上形成一个层，该层包括至少一个集成天线结构，该集成天线结构耦合到该IC器件。