公开(公告)号：US20230230903A1

公开(公告)日：2023-07-20

申请号：US18085746

申请日：2022-12-21

Applicant: Infineon Technologies AG

Inventor： Hooi Boon TEOH ,  Hao ZHUANG ,  Oliver BLANK ,  Paul Armand CALO ,  Markus DINKEL ,  Josef Höglauer ,  Daniel Hölzl ,  Wee Aun JASON LIM ,  Gerhard Thomas Nöbauer ,  Ralf OTREMBA ,  Martin Pölzl ,  Ying Pok SAM ,  Xaver Schlögel ,  Chee Voon TAN

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L24/32 ,  H01L24/05 ,  H01L24/03 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/291 ,  H01L24/29 ,  H01L2224/26145 ,  H01L2224/04026 ,  H01L2224/0361 ,  H01L2224/83801

Abstract: A semiconductor chip is provided. The semiconductor chip may include a front side including a control chip contact and a first controlled chip contact, a back side including a second controlled chip contact, a backside metallization formed over the back side in contact with the second controlled chip contact, and a stop region extending at least partially along an outer edge of the back side between a contact portion of the backside metallization and the outer edge of the back side. The contact portion is configured to be attached to an electrically conductive structure by a die attach material, a surface of the stop region is recessed with respect to a surface of the contact portion, and/or the surface of the stop region has a lower wettability with respect to the die attach material than the contact portion.