公开(公告)号：US20220359328A1

公开(公告)日：2022-11-10

申请号：US17308472

申请日：2021-05-05

Applicant: Infineon Technologies AG

Inventor： Bernhard RIEDER ,  Thomas KILGER

IPC: H01L23/31 ,  H01L21/56 ,  H01Q1/22 ,  H01Q19/06

Abstract: A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.

公开(公告)号：US20190198455A1

公开(公告)日：2019-06-27

申请号：US16227427

申请日：2018-12-20

Applicant: Infineon Technologies AG

Inventor： Walter HARTNER ,  Christian GEISSLER ,  Thomas KILGER ,  Johannes LODERMEYER ,  Franz-Xaver MUEHLBAUER ,  Martin Richard NIESSNER ,  Claus WAECHTER

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01Q1/22

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/3157 ,  H01L23/66 ,  H01L2223/6677 ,  H01Q1/2283

Abstract: A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.

公开(公告)号：US20210125021A1

公开(公告)日：2021-04-29

申请号：US16949155

申请日：2020-10-15

Applicant: Infineon Technologies AG

Inventor： Bernhard RIEDER ,  Thomas KILGER

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

Abstract: A radio-frequency device comprises a radio-frequency chip, a first connecting element arranged over a chip surface of the radio-frequency chip, the first connecting element being designed to mechanically and electrically connect the radio-frequency chip to a circuit board, and a radio-frequency signal carrying element arranged over the chip surface and electrically coupled to the radio-frequency chip, the radio-frequency signal carrying element being covered by an electrically nonconductive material and being designed to transmit a signal in a direction parallel to the chip surface, wherein the first connecting element and the radio-frequency signal carrying element are arranged at a same level in relation to a direction perpendicular to the chip surface, and wherein the first connecting element is spaced apart from the radio-frequency signal carrying element by way of a region that is free of the electrically nonconductive material.