公开(公告)号：US20230369187A1

公开(公告)日：2023-11-16

申请号：US18314459

申请日：2023-05-09

Applicant: Infineon Technologies AG

Inventor： Andre Arens ,  Jens de Bock ,  Xi Zhang ,  Dietmar Spitzer

IPC: H01L23/498 ,  H01L25/07 ,  H01L21/56 ,  H01L23/31 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/49811 ,  H01L25/072 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49838 ,  H05K1/181 ,  H05K1/0213 ,  H05K2201/10151 ,  H05K2201/083

Abstract: A power semiconductor module arrangement includes: a housing; a substrate having a substrate layer and a first metallization layer on a first side of the substrate layer, inside the housing or forming a bottom of the housing; a printed circuit board inside the housing, vertically above and in parallel to the substrate; electrically conducting components on the printed circuit board and substrate; an encapsulant at least partly filling the interior of the housing; and a magnetic field sensor either on the substrate within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the printed circuit board, or on the printed circuit board within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the substrate. The magnetic field sensor is electrically insulated from the respective electrically conducting component.