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1.发明公开公开(公告)号：US20240098389A1
公开(公告)日：2024-03-21
申请号：US18524008
申请日：2023-11-30
Applicant: Infineon Technologies AG
Inventor： Wolfgang Budde , Jens de Bock , Daniel Domes , Andreas Lenniger , Bjoern Rentemeister , Stefan Hubert Schmies , Andreas Vetter
IPC: H04Q9/00
CPC classification number: H04Q9/00 , H04Q2209/10 , H04Q2209/84
Abstract: An electronic device includes an interface configured to receive telemetry information for one or more power semiconductor devices and a data acquisition and processing unit. The data acquisition and processing unit may be configured to increase a gate voltage above a maximum permitted level for each of the one or more power semiconductor devices having a current slew rate that exceeds a predetermined level as determined by the telemetry information. The data acquisition and processing unit may be configured to increase a gate voltage above a maximum permitted level for each of the one or more power semiconductor devices having a temperature that exceeds a predetermined level as determined by the telemetry information. An electronic system that includes the electronic device is also described.
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2.发明公开公开(公告)号：US20230369187A1
公开(公告)日：2023-11-16
申请号：US18314459
申请日：2023-05-09
Applicant: Infineon Technologies AG
Inventor： Andre Arens , Jens de Bock , Xi Zhang , Dietmar Spitzer
CPC classification number: H01L23/49811 , H01L25/072 , H01L21/56 , H01L23/3121 , H01L23/49838 , H05K1/181 , H05K1/0213 , H05K2201/10151 , H05K2201/083
Abstract: A power semiconductor module arrangement includes: a housing; a substrate having a substrate layer and a first metallization layer on a first side of the substrate layer, inside the housing or forming a bottom of the housing; a printed circuit board inside the housing, vertically above and in parallel to the substrate; electrically conducting components on the printed circuit board and substrate; an encapsulant at least partly filling the interior of the housing; and a magnetic field sensor either on the substrate within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the printed circuit board, or on the printed circuit board within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the substrate. The magnetic field sensor is electrically insulated from the respective electrically conducting component.
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3.发明授权公开(公告)号：US11889246B1
公开(公告)日：2024-01-30
申请号：US17857615
申请日：2022-07-05
Applicant: Infineon Technologies AG
Inventor： Wolfgang Budde , Jens de Bock , Daniel Domes , Andreas Lenniger , Bjoern Rentemeister , Stefan Hubert Schmies , Andreas Vetter
IPC: H04Q9/00
CPC classification number: H04Q9/00 , H04Q2209/10 , H04Q2209/84
Abstract: An electronic device includes: an interface configured to receive telemetry information for one or more power semiconductor devices; and a data acquisition and processing unit. The data acquisition and processing unit may be configured to periodically update an estimate of a remaining lifetime of the one or more power semiconductor devices, based on the telemetry information collected during use of the one or more power semiconductor devices and received at the interface. The data acquisition and processing unit may be configured to adjust one or more operating parameters for each of the one or more power semiconductor devices that has reached a predetermined level of degradation as determined by the telemetry information. An electronic system that includes the electronic device is also described.
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4.发明公开公开(公告)号：US20240015417A1
公开(公告)日：2024-01-11
申请号：US17857615
申请日：2022-07-05
Applicant: Infineon Technologies AG
Inventor： Wolfgang Budde , Jens de Bock , Daniel Domes , Andreas Lenniger , Bjoern Rentemeister , Stefan Hubert Schmies , Andreas Vetter
IPC: H04Q9/00
CPC classification number: H04Q9/00 , H04Q2209/84 , H04Q2209/10
Abstract: An electronic device includes: an interface configured to receive telemetry information for one or more power semiconductor devices; and a data acquisition and processing unit. The data acquisition and processing unit may be configured to periodically update an estimate of a remaining lifetime of the one or more power semiconductor devices, based on the telemetry information collected during use of the one or more power semiconductor devices and received at the interface. The data acquisition and processing unit may be configured to adjust one or more operating parameters for each of the one or more power semiconductor devices that has reached a predetermined level of degradation as determined by the telemetry information. An electronic system that includes the electronic device is also described.
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