公开(公告)号：US20240237293A1

公开(公告)日：2024-07-11

申请号：US18534706

申请日：2023-12-10

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Chung-Jyh LIN ,  Chin-Ming HUANG ,  Chien-Lin LAI ,  Kuo-Sheng YEH

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  H05K7/20218

Abstract: An electronic device is provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have rounded-corner structures.

公开(公告)号：US20240237195A1

公开(公告)日：2024-07-11

申请号：US18534734

申请日：2023-12-11

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Chung-Jyh LIN ,  Chin-Ming HUANG ,  Chien-Lin LAI

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0272 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2203/025

Abstract: An electronic device and a manufacturing method of the electronic device are provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have monocrystal structures.