ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230343902A1

    公开(公告)日:2023-10-26

    申请号:US18186291

    申请日:2023-03-20

    CPC classification number: H01L33/46 H01L25/0753 H01L2933/0025

    Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a plurality of light-emitting elements, and a reflective structure. A plurality of light-emitting elements is disposed on the substrate. The reflective structure is disposed on the substrate and located between adjacent two of the plurality of light-emitting elements. The thickness of the reflective structure is designated as Y1, half of a pitch between the adjacent two of the plurality of light-emitting elements is designated as X1, and the light that is emitted by one of the adjacent two of the plurality of light-emitting elements has an emitting angle, and half of the emitting angle is designated as θ. X1, θ, and Y1 conform to the following relationship: X1×0.5×tan(90−θ)≤Y1≤X1×1.8×tan(90−θ).

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