公开(公告)号：US11966133B2

公开(公告)日：2024-04-23

申请号：US18319622

申请日：2023-05-18

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1337

CPC classification number: G02F1/136259 ,  G02F1/1309 ,  G02F1/133504 ,  G02F1/133516 ,  G02F1/133562 ,  G02F1/133788 ,  G02F1/133528

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

公开(公告)号：US11693285B2

公开(公告)日：2023-07-04

申请号：US17477862

申请日：2021-09-17

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/1335 ,  G02F1/1337

CPC classification number: G02F1/136259 ,  G02F1/133504 ,  G02F1/133516 ,  G02F1/133562 ,  G02F1/133788 ,  G02F1/133528

Abstract: An electronic device is disclosed. The electronic device includes a panel, a defect in and/or on the panel and an optical film above the panel. The panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a plurality of display units disposed on the first substrate. There is a defect between the first substrate and the second substrate, or on the second substrate. In a top view of the electronic device, an optical film has a first processed area corresponding to the defect, and the first processed area at least partially overlaps at least two display units.

公开(公告)号：US12253776B2

公开(公告)日：2025-03-18

申请号：US18615105

申请日：2024-03-25

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1337

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

公开(公告)号：US20240258297A1

公开(公告)日：2024-08-01

申请号：US18409824

申请日：2024-01-11

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li Wang ,  Chin-Ming Huang ,  Sheng-Nan Chen

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/544 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/08 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/08225 ,  H01L2224/94 ,  H01L2924/181

Abstract: A manufacturing method of an electronic device and an electronic device are disclosed. The method includes: forming an intermediate layer on a first carrier, patterning the intermediate layer to form alignment marks; forming a release layer on the first carrier; disposing chips on the release layer, each chip including a bonding pad and a surface; forming an insulating layer surrounding the chips on the release layer to form a package structure; transferring the package structure to a second carrier, enabling the surface of each chip to face away from the second carrier and to be exposed by an upper surface of the insulating layer, a step difference formed between the surface of each chip and at least a portion of the upper surface of the insulating layer in a normal direction; and forming a redistribution layer electrically connected to each chip through the bonding pads on the package structure.