公开(公告)号：US12185461B2

公开(公告)日：2024-12-31

申请号：US18073592

申请日：2022-12-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi Wang ,  Chin-Ming Huang ,  Chien-Feng Li ,  Chia-Lin Yang

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

公开(公告)号：US20240128184A1

公开(公告)日：2024-04-18

申请号：US18076374

申请日：2022-12-06

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Chin-Ming Huang ,  Heng-Shen Yeh

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a redistribution layer, an electronic unit, and a conductive bump. The redistribution layer includes a first seed layer, a first conductive layer, and a first insulating layer. The first conductive layer is disposed on the first seed layer, the first insulating layer is disposed on the first conductive layer, and an opening of the first insulating layer exposes at least a portion of the first conductive layer. The electronic unit is electrically connected to the redistribution layer. The conductive bump is disposed between the first conductive layer and the electronic unit and is correspondingly disposed in the opening. The electronic unit is electrically connected to the redistribution layer via the conductive bump. The conductive bump is directly in contact with the first conductive layer.

公开(公告)号：US20240258297A1

公开(公告)日：2024-08-01

申请号：US18409824

申请日：2024-01-11

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Ju-Li Wang ,  Chin-Ming Huang ,  Sheng-Nan Chen

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/544 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/08 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/08225 ,  H01L2224/94 ,  H01L2924/181

Abstract: A manufacturing method of an electronic device and an electronic device are disclosed. The method includes: forming an intermediate layer on a first carrier, patterning the intermediate layer to form alignment marks; forming a release layer on the first carrier; disposing chips on the release layer, each chip including a bonding pad and a surface; forming an insulating layer surrounding the chips on the release layer to form a package structure; transferring the package structure to a second carrier, enabling the surface of each chip to face away from the second carrier and to be exposed by an upper surface of the insulating layer, a step difference formed between the surface of each chip and at least a portion of the upper surface of the insulating layer in a normal direction; and forming a redistribution layer electrically connected to each chip through the bonding pads on the package structure.